CLINTON, N.Y., May 12, 2026 — As a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge on two critical industry topics—data center thermal management and sintering protocols—at the SMTA Electronics in Harsh Environments Conference, May 19-21, in Amsterdam, Netherlands.
Tuesday, May 19
11:30 a.m. CEST – AI Data Center ASIC Cooling – Advanced Solder TIMs presented by Karthik Vijay, Senior Technical Manager, Europe, Africa, and the Middle East.
As AI data centers push the limits of high-power ASIC performance, advanced solder-based thermal interface materials (sTIMs) are emerging as a critical solution. Unlike traditional thermal greases and polymer PCMs, indium-based sTIMs deliver 86W/mK conductivity with no performance degradation over time. This presentation examines three sTIM forms—compressible patterned foils, reflowable solders, and liquid metals—to determine their reliability capabilities for next-generation thermal management for direct-chip and immersion-cooling applications.
11:30 a.m. CEST – IEC Protocols: A Study to Establish Standards for Sintering Protocols presented by Andreas Karch, Regional Technical Manager and Technologist – Advanced Applications.
As electrification in power electronics brings ever-increasing reliability requirements, sintering is gaining importance as a high-performance alternative to soldering, enabling the operation of chips at temperatures above 200°C in SiC and GaN applications for the automotive industry. However, unlike soldering, the sintering process lacks industry-wide standards for mass production. This presentation describes the research conducted by the DKE working group and the IEC on the standardization of sintering processes, including pressure-assisted, pressureless, and pressure sintering processes, materials, equipment, test methods, and the evaluation of joint quality.
À propos des présentateurs
Karthik Vijay is responsible for technology programs and technical support for customers in Europe, Africa, and the Middle East. His expertise is in automotive, industrial, and RF applications involving PCBA and power electronics with a focus on the use of different material sets, including solder preforms, solder paste, thermal interface materials, and semiconductor-grade electronics materials.
Andreas Karch provides technical support to customers in Germany, Austria, and Switzerland, sharing process knowledge and technical guidance and application recommendations for Indium Corporation’s complete portfolio of solder paste, solder preforms, fluxes, and thermal management materials.
To learn more about Indium Corporation’s thermal interface materials and sintering product portfolio, visit indium.com.
À propos d'Indium Corporation
IndiumCorporation® est l'un des principaux raffineurs, fondeurs, fabricants et fournisseurs de matériaux destinés aux marchés mondiaux de l'électronique, des semi-conducteurs, des couches minces et de la gestion thermique. Sa gamme de produits comprend des soudures et des flux ; des alliages de brasage ; des matériaux d'interface thermique ; des cibles de pulvérisation ; de l'indium, du gallium, du germanium et de l'étain sous forme de métaux et de composés inorganiques ; ainsi quele NanoFoil®. Fondée en 1934, la société dispose d'un service d'assistance technique mondial et d'usines situées en Chine, en Allemagne, en Inde, en Malaisie, à Singapour, en Corée du Sud, au Royaume-Uni et aux États-Unis.
Pour plus d'informations sur Indium Corporation, rendez-vous sur www.indium.com ou envoyez un e-mail à [email protected]. Vous pouvez également suivre nos experts, « From One Engineer ToAnother® » (#FOETA), sur www.linkedin.com/company/indium-corporation/.
