CLINTON, N.Y., May 12, 2026 — As a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge on two critical industry topics—data center thermal management and sintering protocols—at the SMTA Electronics in Harsh Environments Conference, May 19-21, in Amsterdam, Netherlands.
Tuesday, May 19
11:30 a.m. CEST – AI Data Center ASIC Cooling – Advanced Solder TIMs presented by Karthik Vijay, Senior Technical Manager, Europe, Africa, and the Middle East.
As AI data centers push the limits of high-power ASIC performance, advanced solder-based thermal interface materials (sTIMs) are emerging as a critical solution. Unlike traditional thermal greases and polymer PCMs, indium-based sTIMs deliver 86W/mK conductivity with no performance degradation over time. This presentation examines three sTIM forms—compressible patterned foils, reflowable solders, and liquid metals—to determine their reliability capabilities for next-generation thermal management for direct-chip and immersion-cooling applications.
11:30 a.m. CEST – IEC Protocols: A Study to Establish Standards for Sintering Protocols presented by Andreas Karch, Regional Technical Manager and Technologist – Advanced Applications.
As electrification in power electronics brings ever-increasing reliability requirements, sintering is gaining importance as a high-performance alternative to soldering, enabling the operation of chips at temperatures above 200°C in SiC and GaN applications for the automotive industry. However, unlike soldering, the sintering process lacks industry-wide standards for mass production. This presentation describes the research conducted by the DKE working group and the IEC on the standardization of sintering processes, including pressure-assisted, pressureless, and pressure sintering processes, materials, equipment, test methods, and the evaluation of joint quality.
About the Presenters
Karthik Vijay is responsible for technology programs and technical support for customers in Europe, Africa, and the Middle East. His expertise is in automotive, industrial, and RF applications involving PCBA and power electronics with a focus on the use of different material sets, including solder preforms, solder paste, thermal interface materials, and semiconductor-grade electronics materials.
Andreas Karch provides technical support to customers in Germany, Austria, and Switzerland, sharing process knowledge and technical guidance and application recommendations for Indium Corporation’s complete portfolio of solder paste, solder preforms, fluxes, and thermal management materials.
To learn more about Indium Corporation’s thermal interface materials and sintering product portfolio, visit indium.com.
인디엄 코퍼레이션 소개
인듐코퍼레이션®(Indium Corporation®) 은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 소재 정제, 제련, 제조 및 공급 서비스를 제공하는 선도적인 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열전도성 인터페이스 재료, 스퍼터링 타겟, 인듐·갈륨·게르마늄·주석 금속 및 무기 화합물, 그리고NanoFoil® 등이 있습니다. 1934년에 설립된 이 회사는 전 세계적인 기술 지원 체계를 갖추고 있으며, 중국, 독일, 인도, 말레이시아, 싱가포르, 한국, 영국, 미국에 공장을 운영하고 있습니다.
인듐 코퍼레이션(Indium Corporation)에 대한 자세한 정보는 www.indium.com을 방문하거나 [email protected]으로 이메일을 보내 주시기 바랍니다. 또한 www.linkedin.com/company/indium-corporation/에서 당사의 전문가 그룹인 ‘From One Engineer ToAnother® (#FOETA)’를 팔로우하실 수 있습니다.
