Indium Corporation’s Wisdom Qu, technical manager, presented at an IPC Seminar on Oct. 29 in Suzhou, China.
Qu’s presentation, Material and Process Optimization for HIP Defect Elimination, included an overview of Head-in-Pillow (HIP) defects and how process and material selection can have a significant impact on the potential for HIP defects. Qu discussed how printing and reflow process optimization can help to significantly reduce the potential for HIP, including the critical solder paste attributes that can help minimize the occurrence of HIP defects.
Qu is an SMTA-certified process engineer with more than nine years of experience in surface mount technology. Indium Corporation recognized her knowledge, expertise, and accomplishments in 2007 and 2011 with the prestigious Silver Quill Award for Best Technical Paper/Presentation of the year. She holds a degree in mathematics from Hubei Radio and Television University in China.
IPC is a global trade association dedicated to furthering the competitive excellence and financial success of its electronics industry members.
Indium Corporation est un fabricant et fournisseur de matériaux de premier plan sur les marchés mondiaux de l'électronique, des semi-conducteurs, de l'énergie solaire, des couches minces et de la gestion thermique. Ses produits comprennent des soudures et des flux, des brasures, des matériaux d'interface thermique, des cibles de pulvérisation, des métaux et des composés inorganiques à base d'indium, de gallium, de germanium et d'étain, ainsi que des NanoFoil®. Fondée en 1934, Indium dispose d'une assistance technique mondiale et d'usines situées en Chine, en Malaisie, à Singapour, en Corée du Sud, au Royaume-Uni et aux États-Unis.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
