Indium Corporation’s Wisdom Qu, technical manager, presented at an IPC Seminar on Oct. 29 in Suzhou, China.
Qu’s presentation, Material and Process Optimization for HIP Defect Elimination, included an overview of Head-in-Pillow (HIP) defects and how process and material selection can have a significant impact on the potential for HIP defects. Qu discussed how printing and reflow process optimization can help to significantly reduce the potential for HIP, including the critical solder paste attributes that can help minimize the occurrence of HIP defects.
Qu is an SMTA-certified process engineer with more than nine years of experience in surface mount technology. Indium Corporation recognized her knowledge, expertise, and accomplishments in 2007 and 2011 with the prestigious Silver Quill Award for Best Technical Paper/Presentation of the year. She holds a degree in mathematics from Hubei Radio and Television University in China.
IPC is a global trade association dedicated to furthering the competitive excellence and financial success of its electronics industry members.
Die Indium Corporation ist ein führender Materialhersteller und -lieferant für die weltweiten Elektronik-, Halbleiter-, Solar-, Dünnschicht- und Wärmemanagementmärkte. Zu den Produkten gehören Lote und Flussmittel, Hartlote, Materialien für thermische Schnittstellen, Sputtertargets, Metalle und anorganische Verbindungen aus Indium, Gallium, Germanium und Zinn sowie NanoFoil®. Das 1934 gegründete Unternehmen verfügt über einen weltweiten technischen Support und Fabriken in China, Malaysia, Singapur, Südkorea, dem Vereinigten Königreich und den USA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
