Indium Corporation’s Wisdom Qu, technical manager, presented at an IPC Seminar on Oct. 29 in Suzhou, China.
Qu’s presentation, Material and Process Optimization for HIP Defect Elimination, included an overview of Head-in-Pillow (HIP) defects and how process and material selection can have a significant impact on the potential for HIP defects. Qu discussed how printing and reflow process optimization can help to significantly reduce the potential for HIP, including the critical solder paste attributes that can help minimize the occurrence of HIP defects.
Qu is an SMTA-certified process engineer with more than nine years of experience in surface mount technology. Indium Corporation recognized her knowledge, expertise, and accomplishments in 2007 and 2011 with the prestigious Silver Quill Award for Best Technical Paper/Presentation of the year. She holds a degree in mathematics from Hubei Radio and Television University in China.
IPC is a global trade association dedicated to furthering the competitive excellence and financial success of its electronics industry members.
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
