Indium Corporation’s Wisdom Qu, technical manager, presented at an IPC Seminar on Oct. 29 in Suzhou, China.
Qu’s presentation, Material and Process Optimization for HIP Defect Elimination, included an overview of Head-in-Pillow (HIP) defects and how process and material selection can have a significant impact on the potential for HIP defects. Qu discussed how printing and reflow process optimization can help to significantly reduce the potential for HIP, including the critical solder paste attributes that can help minimize the occurrence of HIP defects.
Qu is an SMTA-certified process engineer with more than nine years of experience in surface mount technology. Indium Corporation recognized her knowledge, expertise, and accomplishments in 2007 and 2011 with the prestigious Silver Quill Award for Best Technical Paper/Presentation of the year. She holds a degree in mathematics from Hubei Radio and Television University in China.
IPC is a global trade association dedicated to furthering the competitive excellence and financial success of its electronics industry members.
Indium Corporation es uno de los principales fabricantes y proveedores de materiales para los mercados mundiales de la electrónica, los semiconductores, la energía solar, la capa fina y la gestión térmica. Sus productos incluyen soldaduras y fundentes; soldaduras fuertes; materiales de interfaz térmica; cátodos para sputtering; metales y compuestos inorgánicos de indio, galio, germanio y estaño; y NanoFoil®. Fundada en 1934, Indium cuenta con asistencia técnica mundial y fábricas en China, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
