Indium Corporation’s Wisdom Qu, technical manager, presented at an IPC Seminar on Oct. 29 in Suzhou, China.
Qu’s presentation, Material and Process Optimization for HIP Defect Elimination, included an overview of Head-in-Pillow (HIP) defects and how process and material selection can have a significant impact on the potential for HIP defects. Qu discussed how printing and reflow process optimization can help to significantly reduce the potential for HIP, including the critical solder paste attributes that can help minimize the occurrence of HIP defects.
Qu is an SMTA-certified process engineer with more than nine years of experience in surface mount technology. Indium Corporation recognized her knowledge, expertise, and accomplishments in 2007 and 2011 with the prestigious Silver Quill Award for Best Technical Paper/Presentation of the year. She holds a degree in mathematics from Hubei Radio and Television University in China.
IPC is a global trade association dedicated to furthering the competitive excellence and financial success of its electronics industry members.
Indium Corporation은 전 세계 전자, 반도체, 태양광, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
