Gold-Alloy Solder Paste
AuLTRA® 5.1
AuLTRA® 5.1 is a no-clean solder paste, formulated with AuSn, that can be used with air or nitrogen reflow processes. It is specifically designed to handle the higher processing temperatures required for Au-based alloys. Ideal for high-power LED module array assembly applications, this product offers a wide processing window and consistent print definition, even those with ultra-fine pitches. In addition to consistent printing and reflow requirements, AuLTRA® 5.1 features superb wetting and low-voiding.
Powered by Indium Corporation
- No-Clean Residue
- Exceptional Wetting in Air Reflow
- Low Voiding
Product Overview
Dispensing
AuLTRA® 5.1 is formulated for automated high-speed, high reliability, or single- or multi-point dispensing equipment. It also functions well in hand-held applications. Highly accurate volumes can be dispensed using either pneumatic or positive displacement devices. Optimal dispensing performance depends on storage conditions, equipment type, and setup.
Gold-Tin Alloy Options
- 80Au20Sn
- 79Au21Sn
- 78Au22Sn
- 77Au23Sn
Packaging
AuLTRA® 5.1 is available in jars or syringes. Standard packaging for dispensing applications include 10 and 30cc syringes. Other packaging options are available upon request.
Particle Size
AuLTRA® 5.1 is available in powder sizes 2 to 7 C (see Powder Capabilities). Metal loadings vary from 89–94%, according to the intended application method and particle size. Please contact us to determine the best product specification for your needs.
Powder Capabilities
- Type 2 (-200/+325)
- Type 3 (-325/+500)
- Type 4 (-400/+635)
- Type 5 (-500/+635)
- Type 6 C (5–15μm w/less than 10% overs/unders)
- Type 6 (-635)
- Type 7 C (2–11μm w/less than 10% overs/unders)
Features
With more than 200 alloys available, we have solutions for temperatures up to 1,100°C. As an alternative to traditional high-lead options, we currently offer—and are continuously developing—novel lead-free solutions, including gold solders, sintering, preforms, and alloy technology with new flux systems.
>280°C
High melting point is compatible with subsequent reflow processes
Critical Applications
Automotive, RF infrastructure, medical, laser, military, and aerospace applications
Pb-Free
Lead-free and RoHS-compliant
#1 in Reliability
Highest tensile strength of any solder
AuLTRA® 5.1 Products
See our standard and premium gold-alloy preform products below:
| Product | Alloy Options | Key Features | IPC Classification | Product Data Sheets |
|---|---|---|---|---|
| AuLTRA® 5.1 | 80Au20Sn 79Au21Sn 78Au22SN 77Au23Sn | No-Clean | ROL1 | Learn More |
| AuLTRA® 5.1LS | 80Au20Sn 79Au21Sn 78Au22SN 77Au23Sn | No-Clean Low-Slump | ROL1 | Learn More |
Product Data Sheets
AuLTRA® 5.1 AuSn No-Clean Solder Paste PDS 99987 (A4) R3.pdf
AuLTRA® 5.1 AuSn No-Clean Solder Paste PDS 99987 R3.pdf
AuLTRA® 5.1LS Low-Slump AuSn No-Clean Solder Paste PDS 100153 (A4) R1.pdf
AuLTRA® 5.1LS Low-Slump AuSn No-Clean Solder Paste PDS 100153 R1.pdf
Related Applications
AuLTRA® 5.1 products are suitable for a variety of applications.
High-Reliability
Various options for various high-reliability PCBA
Die-Attach
Die-attach solutions include solder pastes to gold-based
High-Temperature Soldering
Offering high-temperature soldering materials for critical applications in harsh
Related Markets
Indium Corporation is a leading gold solder innovator that provides high-temperature, high-reliability, and critical applications to the following areas:
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