Gold-Alloy Solder Paste

^AuLTRA® 5.1

AuLTRA® 5.1 is a no-clean solder paste, formulated with AuSn, that can be used with air or nitrogen reflow processes. It is specifically designed to handle the higher processing temperatures required for Au-based alloys. Ideal for high-power LED module array assembly applications, this product offers a wide processing window and consistent print definition, even those with ultra-fine pitches. In addition to consistent printing and reflow requirements, AuLTRA® 5.1 features superb wetting and low-voiding.

Indium Corporation 제공

No-Clean Residue
Exceptional Wetting in Air Reflow
낮은 보이드

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제품 개요

Dispensing

AuLTRA® 5.1 is formulated for automated high-speed, high reliability, or single- or multi-point dispensing equipment. It also functions well in hand-held applications. Highly accurate volumes can be dispensed using either pneumatic or positive displacement devices. Optimal dispensing performance depends on storage conditions, equipment type, and setup.

Gold-Tin Alloy Options

80Au20Sn
79Au21Sn
78Au22Sn
77Au23Sn

패키징

AuLTRA® 5.1 is available in jars or syringes. Standard packaging for dispensing applications include 10 and 30cc syringes. Other packaging options are available upon request.

Particle Size

AuLTRA® 5.1 is available in powder sizes 2 to 7 C (see Powder Capabilities). Metal loadings vary from 89–94%, according to the intended application method and particle size. Please contact us to determine the best product specification for your needs.

Powder Capabilities

Type 2 (-200/+325)
Type 3 (-325/+500)
Type 4 (-400/+635)
Type 5 (-500/+635)
Type 6 C (5–15 μm w/less than 10% overs/unders)
Type 6 (-635)
Type 7 C (2–11 μm w/less than 10% overs/unders)

특징

With more than 200 alloys available, we have solutions for temperatures up to 1,100°C. As an alternative to traditional high-lead options, we currently offer—and are continuously developing—novel lead-free solutions, including gold solders, sintering, preforms, and alloy technology with new flux systems.

>280°C

High melting point is compatible with subsequent reflow processes.

중요 애플리케이션

Automotive, RF infrastructure, medical, laser, military, and aerospace applications.

무연

Lead-free and RoHS-compliant.

#신뢰성 부문 1위

Highest tensile strength of any solder.

AuLTRA® 5.1 Products

See our standard and premium gold-alloy preform products below:

제품	Alloy Options	주요 기능	IPC 분류	제품 데이터 시트
^AuLTRA® 5.1	80Au20Sn 79Au21Sn 78Au22SN 77Au23Sn	노클린	ROL1	자세히 알아보기
AuLTRA^® 5.1LS	80Au20Sn 79Au21Sn 78Au22SN 77Au23Sn	No-Clean Low-Slump	ROL1	자세히 알아보기