金合金焊膏

^AuLTRA®5.1

AuLTRA® 5.1 is a no-clean solder paste, formulated with AuSn, that can be used with air or nitrogen reflow processes. It is specifically designed to handle the higher processing temperatures required for Au-based alloys. Ideal for high-power LED module array assembly applications, this product offers a wide processing window and consistent print definition, even those with ultra-fine pitches. In addition to consistent printing and reflow requirements, AuLTRA® 5.1 features superb wetting and low-voiding.

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No-Clean Residue
Exceptional Wetting in Air Reflow
低排尿量

標有「AuLTRA™ 5.1 焊膏」的針筒狀容器，中性背景上有 Indium Corporation 標誌。

產品總覽

點膠

AuLTRA® 5.1 is formulated for automated high-speed, high reliability, or single- or multi-point dispensing equipment. It also functions well in hand-held applications. Highly accurate volumes can be dispensed using either pneumatic or positive displacement devices. Optimal dispensing performance depends on storage conditions, equipment type, and setup.

金錫合金選項

80Au20Sn
79Au21Sn
78Au22Sn
77Au23Sn

包裝

AuLTRA® 5.1 is available in jars or syringes. Standard packaging for dispensing applications include 10 and 30cc syringes. Other packaging options are available upon request.

顆粒尺寸

AuLTRA® 5.1 is available in powder sizes 2 to 7 C (see Powder Capabilities). Metal loadings vary from 89–94%, according to the intended application method and particle size. Please contact us to determine the best product specification for your needs.

粉末能力

類型 2 (-200/+325)
類型 3 (-325/+500)
類型 4 (-400/+635)
第五類 (-500/+635)
Type 6 C (5–15 μm w/less than 10% overs/unders)
6 型 (-635)
Type 7 C (2–11 μm w/less than 10% overs/unders)

特點

With more than 200 alloys available, we have solutions for temperatures up to 1,100°C. As an alternative to traditional high-lead options, we currently offer—and are continuously developing—novel lead-free solutions, including gold solders, sintering, preforms, and alloy technology with new flux systems.

>280°C

High melting point is compatible with subsequent reflow processes.

關鍵應用

Automotive, RF infrastructure, medical, laser, military, and aerospace applications.

無鉛

Lead-free and RoHS-compliant.

#可靠性排名第一

Highest tensile strength of any solder.

AuLTRA® 5.1 Products

請參閱以下我們的標準和優質金合金預成型產品：

產品	合金選項	主要功能	IPC 分類	產品資料表
^AuLTRA®5.1	80Au20Sn 79Au21Sn 78Au22SN 77Au23Sn	免清洗	ROL1	瞭解更多
AuLTRA^® 5.1LS	80Au20Sn 79Au21Sn 78Au22SN 77Au23Sn	No-Clean Low-Slump	ROL1	瞭解更多