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CLINTON, N.Y., October 23, 2026 — Five tech experts from Indium Corporation, a leading developer of AI-enabling and high-reliability soldering materials, will share new technical insights at SMTA

The following press release was issued by Micron Technology on October 20, 2026, regarding its partnership with Indium Corporation®. It is republished here with permission. Original headline: Micron

CLINTON, N.Y., 15 ottobre 2026 — Indium Corporation®, leader del settore nelle soluzioni innovative con materiali per il packaging dei semiconduttori e l’assemblaggio elettronico, ha ricevuto il Mexico Technology Award

CLINTON, N.Y., 9 ottobre 2026 — Andreas Karch, responsabile tecnico regionale e tecnologo per le applicazioni avanzate presso Indium Corporation®, illustrerà il proprio lavoro volto a sviluppare standard di settore per

CLINTON,

CLINTON, N.Y., 24 settembre 2026 — Ryan Mayberry, ingegnere senior per lo sviluppo delle applicazioni presso la divisione Engineered Solder Materials (ESM) di Indium Corporation®, parlerà della saldatura con acido formico e della sua crescente diffusione

CLINTON, N.Y., October 2, 2026 — Indium Corporation® Regional Technical Manager and Technologist – Advanced Applications Andreas Karch will explore how combining innovative solder materials with

CLINTON, N.Y., September 28, 2026 – As an industry leader in innovative materials solutions for electronics packaging, Indium Corporation® will showcase its high-reliability solder pastes for

CLINTON, N.Y., September 25, 2026 – Indium Corporation, a leading materials manufacturer and supplier to the global electronics, semiconductor, and thermal management markets, will feature a

CLINTON, N.Y., September 25, 2026 — As a leading provider of high-reliability, AI-enabling soldering materials, three Indium Corporation experts will share new research and insights on addressing

CLINTON, N.Y., September 10, 2026 — Indium Corporation is pleased to announce the promotion of Chris Bastecki to Business Unit Vice President, Americas Sales & Service and Global Printed

to Research and Development Director CLINTON, N.Y., September 3, 2026 — Indium Corporation has promoted Hongwen Zhang, Ph.D., to Research and Development (R&D) Director. In this role, he will

TAIPEI, Taiwan, September 2, 2026 — As artificial intelligence (AI) and high-performance computing (HPC) continue to accelerate semiconductor innovation, the industry is moving beyond the challenge

CLINTON, N.Y., September 1, 2026 — With a team of manufacturing and technical experts supporting customers across India, Indium Corporation will feature its portfolio of high-performance

CLINTON, N.Y., August 31, 2026 — Indium Corporation® Senior Area Technical Manager Luis Pan will discuss how precisely matching materials and assembly processes can positively impact yield and

CLINTON, N.Y., August 28, 2026 — Indium Corporation® Senior Area Technical Manager Jason Chou will discuss solutions designed to address the high-power consumption and complex packaging challenges

CLINTON, N.Y., August 24, 2026 — Indium Corporation® Senior Area Technical Manager Leo Hu will examine the keys to precisely matching the diverse process requirements of power module packaging and

CLINTON, N.Y., August 21, 2026 — Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how key material innovations can collaboratively address cutting-edge advanced packaging

CLINTON, N.Y., August 20, 2026 – As a leading provider of advanced materials solutions for power device packaging, Indium Corporation® will feature its lineup of high-reliability

CLINTON, N.Y., August 11, 2026 — Innovation begins with people and—for the 14th consecutive year—Indium Corporation’s award-winning summer internship program has cultivated the next

CLINTON, N.Y., August 11, 2026 — Indium Corporation, a leading provider of innovative materials solutions for electronics assembly, semiconductor packaging, and thermal management applications,