Indium Corporation has earned the CIRCUITS ASSEMBLY New Product Introduction (NPI) Award for its low-temperature alloy technology, Durafuse™ LT at the IPC APEX Expo technical conference on February 4 in San Diego, Calif., USA.
The NPI Awards recognize the leading new products for electronics assembly during the past 12 months. Honorees are selected by an independent panel of practicing engineers.
“We developed Durafuse™ LT as a solution to the challenges of conventional low-temperature solders. Having the electronics assembly industry recognize it as a leading new product is truly an honor,” said Chris Nash, Product Manager for PCB Assembly Solder Paste. “I am very proud of our team and the work they have done and continue to do to develop and deliver this and other high-reliability products to our customers.”
Durafuse™ LT is a novel, low-temperature alloy system designed to provide high-reliability in low-temperature applications that need to reflow below 210°C. Where traditional low-temperature solders can produce brittle solder joints that are susceptible to drop shock failures, Durafuse™ LT provides improved drop shock resilience, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup. Durafuse™ LT:
- Fornisce una soluzione per i componenti sensibili al calore e i polimeri flessibili
- Impedisce la deformazione termica dei componenti del processore e delle schede multistrato
- Soddisfa i requisiti di bassa temperatura per la saldatura a passo, in particolare nelle applicazioni di fissaggio di schermi RF e di rilavorazione.
Learn more about Indium Corporation’s innovative low-temperature technology at booth 1037 at APEX, or online at indiumstg.wpenginepowered.com/applications/pcb-assembly/low-temperature-soldering.
Indium Corporation è uno dei principali produttori e fornitori di materiali per i mercati globali dell'elettronica, dei semiconduttori, dei film sottili e della gestione termica. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, target per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil®. Fondata nel 1934, l'azienda dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, India, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
