Indium Corporation has earned the CIRCUITS ASSEMBLY New Product Introduction (NPI) Award for its low-temperature alloy technology, Durafuse™ LT at the IPC APEX Expo technical conference on February 4 in San Diego, Calif., USA.
NPI 獎表揚在過去 12 個月內領先的電子組裝新產品。獲獎者由執業工程師組成的獨立評審團選出。
“We developed Durafuse™ LT as a solution to the challenges of conventional low-temperature solders. Having the electronics assembly industry recognize it as a leading new product is truly an honor,” said Chris Nash, Product Manager for PCB Assembly Solder Paste. “I am very proud of our team and the work they have done and continue to do to develop and deliver this and other high-reliability products to our customers.”
Durafuse™ LT is a novel, low-temperature alloy system designed to provide high-reliability in low-temperature applications that need to reflow below 210°C. Where traditional low-temperature solders can produce brittle solder joints that are susceptible to drop shock failures, Durafuse™ LT provides improved drop shock resilience, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup. Durafuse™ LT:
- 為熱敏元件和柔性聚合物提供解決方案
- 防止處理器元件和多層板的熱彎曲
- 符合階梯式焊接的低溫要求，特別是在 RF 屏蔽附件和返修應用中
Learn more about Indium Corporation’s innovative low-temperature technology at booth 1037 at APEX, or online at indiumstg.wpenginepowered.com/applications/pcb-assembly/low-temperature-soldering.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、印度、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
