Indium Corporation's Seven Liang, Area Technical Manager for Shenzhen, will share his technical expertise at the Manufacturing and Processes for High-Reliability and System-in-Package Applications seminar on May 24 in Huizhou, China.
Liang's presentation, How to Achieve High Reliability in Automotive Electronics, will focus on how to address the unique challenges encountered by automotive electronics assemblers. Topics will include materials for achieving high-performance on first yields, electrochemical reliability, voiding, and coating. He will also share the test results of a new high-reliability alloy.
Liang provides technical support for Indium Corporation's electronics assembly materials, semiconductor and advanced assembly materials, engineered solders, and thermal management materials. He has more than a decade of experience in surface mount technology.
The seminar will also include presentations regarding common defects analysis and testing for PCBA soldering, smart design for electronics assembly lines, and how to calculate the reliability shelf life for electronics.
Indium Corporation è uno dei principali produttori e fornitori di materiali per i mercati globali dell'elettronica, dei semiconduttori, dei film sottili e della gestione termica. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, target per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil®. Fondata nel 1934, l'azienda dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
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