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Indium Corporation Expert to Present at High-Reliability Applications and SiP Seminar

Indium Corporation's Seven Liang, Area Technical Manager for Shenzhen, will share his technical expertise at the Manufacturing and Processes for High-Reliability and System-in-Package Applications seminar on May 24 in Huizhou, China.

Liang's presentation, How to Achieve High Reliability in Automotive Electronics, will focus on how to address the unique challenges encountered by automotive electronics assemblers. Topics will include materials for achieving high-performance on first yields, electrochemical reliability, voiding, and coating. He will also share the test results of a new high-reliability alloy. 

Liang provides technical support for Indium Corporation's electronics assembly materials, semiconductor and advanced assembly materials, engineered solders, and thermal management materials. He has more than a decade of experience in surface mount technology.

The seminar will also include presentations regarding common defects analysis and testing for PCBA soldering, smart design for electronics assembly lines, and how to calculate the reliability shelf life for electronics. 

铟泰公司 是一家面向全球电子、半导体、薄膜及热管理 市场的顶级材料制造商和供应商。产品包括焊料和助焊剂;硬钎焊 ;热界面材料;溅射靶材 ;铟、镓(Ga) 、锗和锡等金属及无机材料化合物 ;以及NanoFoil®。该公司成立于1934年,拥有全球技术支持网络,并在中国、马来西亚 、新加坡 、韩国、英国和美国设有工厂。

如需了解铟泰公司更多信息,请访问indiumstg.wpenginepowered.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家团队“From One Engineer ToAnother®”(#FOETA)。