Indium Corporation's Seven Liang, Area Technical Manager for Shenzhen, will share his technical expertise at the Manufacturing and Processes for High-Reliability and System-in-Package Applications seminar on May 24 in Huizhou, China.
Liang 的演讲主题是 "如何实现汽车电子产品的高可靠性"，将重点讨论如何应对汽车电子产品装配商所遇到的独特挑战。主题将包括实现高性能首批量的材料、电化学可靠性、空洞化和涂层。他还将分享一种新型高可靠性合金的测试结果。
Liang provides technical support for Indium Corporation's electronics assembly materials, semiconductor and advanced assembly materials, engineered solders, and thermal management materials. He has more than a decade of experience in surface mount technology.
研讨会还将介绍 PCBA 焊接的常见缺陷分析和测试、电子装配线的智能设计以及如何计算电子产品的可靠性保质期。
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
