Indium Corporation's Seven Liang, Area Technical Manager for Shenzhen, will share his technical expertise at the Manufacturing and Processes for High-Reliability and System-in-Package Applications seminar on May 24 in Huizhou, China.
Liang's presentation, How to Achieve High Reliability in Automotive Electronics, will focus on how to address the unique challenges encountered by automotive electronics assemblers. Topics will include materials for achieving high-performance on first yields, electrochemical reliability, voiding, and coating. He will also share the test results of a new high-reliability alloy.
Liang provides technical support for Indium Corporation's electronics assembly materials, semiconductor and advanced assembly materials, engineered solders, and thermal management materials. He has more than a decade of experience in surface mount technology.
The seminar will also include presentations regarding common defects analysis and testing for PCBA soldering, smart design for electronics assembly lines, and how to calculate the reliability shelf life for electronics.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件至 [email protected]。您也可以透過www.facebook.com/indium或@IndiumCorp 追蹤我們的專家，From One Engineer ToAnother®(#FOETA)。
