Indium Corporation was honored with two prestigious GLOBAL Technology Awards during an awards ceremony on November 14 at Productronica in Munich, Germany. The company was honored in both the Flux and Adhesives/Underfills Encapsulants categories for NC-809, a halogen-free, ultra-low residue flip-chip flux, and InTACK, a drop-in, robust tacking agent for power module assembly, respectively. Presented by Global SMT & Packaging, the Global Technology Awards recognize the best new innovations in the printed circuit assembly and packaging industries introduced in the past 12 months.
Engineered with high-tack characteristics, NC-809 is an ultra-low residue (ULR) flux designed to hold fine-pitch die or solder spheres in place without risk of shift during the assembly process. It leaves minimal residue after reflow which makes NC-809 compatible with flip-chip assembly process where a cleaning process is not desired. NC-809, due to its lack of residue, is compatible with many common underfill materials. NC-809 exhibits superior wetting performance and is the first ULR flux qualified for ball grid array ball-attach applications for packages that are sensitive to traditional water cleaning processes. NC-809 also improves production yields by eliminating costly cleaning steps which can increase substrate warpage both after reflow and before the underfilling steps, creating the potential for die damage and cracked solder joints.
To learn more about this product and Indium Corporation’s suite of proven ultra-low residue fluxes, visit www.indium.com/products/fluxes/semiconductor-fluxes/.
InTACK is a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes. Designed for use in no-flux reflow applications with formic acid, InTACK is specially formulated with high tack to hold a die, chip, or solder preform in place without movement, creating a low-cost tooling-free solution without compromising soldering quality. While InTACK has the tack strength to hold materials in place, the material is completely evaporated out during reflow, eliminating the time consuming post-reflow residue cleaning steps.
Per ulteriori informazioni su InTACK, contattare Joe Hertline, Product Manager ESM/Elettronica di potenza di Indium Corporation.
Informazioni su Indium Corporation
Indium Corporation è un'azienda leader nella raffinazione, fusione, produzione e fornitura di materiali per i mercati globali dell'elettronica, dei semiconduttori, dei film sottili e della gestione termica. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, bersagli per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil. Fondata nel 1934, l'azienda dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Germania, India, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
Per ulteriori informazioni su Indium Corporation, visitare il sito www.indium.com o inviare un'e-mail a Jingya Huang. È inoltre possibile seguire i nostri esperti, From One Engineer To Another (#FOETA), all'indirizzo www.linkedin.com/company/indium-corporation/.
