Indium Corporation is set to deliver a technical presentation and exhibit its industry-leading products for power electronics assembly at PCIM Asia, August 29-31, in Shanghai, China.
Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation titled Innovative High-Temperature Lead-Free Die-Attach Soldering Materials and Applications. He will examine the characteristics, applications, and process optimization related to new high-temperature, lead-free materials and their reliability testing data.
Power semiconductors are the core of electric energy conversion and circuit control in electronic devices, and are widely used in new energy vehicles, energy storage, data centers, photovoltaics, and industrial applications. In response to industry changes, Indium Corporation has launched a number of innovative high-temperature lead-free solutions, such as new high-temperature lead-free solder paste, pressured and non-pressured silver sintering paste, and copper sintering materials for die-attach.
“The power density of the third-generation semiconductors represented by SiC has been greatly improved, and higher requirements are placed on the on-resistance, thermal conductivity and reliability of die-attach materials,” said Hu. “Combined with the exemption of high-lead solder expiring in 2024, it is imperative for the industry to evaluate new and innovative high-temperature, lead-free solutions.”
As Senior Area Technical Manager for East China, Hu manages the technical support team in East China, and collaborates with global technical support teams to provide Indium Corporation customers with product and application solutions. He has more than 15 years of experience in semiconductor packaging and possesses expertise in advanced assembly technology development, process improvement, and assembly materials applications. Hu earned a master’s degree in IC engineering from the Chinese Academy of Science and a bachelor’s degree in electronic information science and technology from Nankai University, Tianjin, China.
Indium Corporation’s products for power electronics have been demonstrated to reduce energy consumption and solve warpage issues for its customers while ensuring high reliability and improving overall efficiency.
Featured products include:
- InTACK è una soluzione adesiva senza residui e senza alogeni, sviluppata per mantenere in posizione i pezzi durante i processi di posizionamento e rifusione. Progettato per l'uso in applicazioni di riflusso senza flusso con acido formico, InTACK è appositamente formulato con un'elevata adesività per mantenere in posizione una matrice, un chip o una preforma di saldatura senza movimenti, riducendo la dipendenza dagli utensili senza compromettere la qualità della saldatura o della sinterizzazione.
- InFORMS reinforced solder alloy fabrications that improve mechanical and thermal reliability and are specifically designed to produce consistent bondline thickness for power module applications. They also address specific challenges for the power electronics industry by providing an enhanced material for the development of more reliable and higher performance modules.
- Indalloy301 LT Alloy for Preforms/InFORMS una nuova lega priva di Pb che consente temperature di lavorazione più basse nella saldatura delle preforme rispetto alle leghe SAC. Specificamente progettata per le applicazioni dei moduli di potenza, questa lega previene le deformazioni negli scenari di attacco pacchetto-raffreddatore senza sacrificare l'affidabilità come le tradizionali leghe a bassa temperatura contenenti bismuto. È disponibile in preforme, nastri o InFORMS.
- InFORCE29 a pressure copper sinter paste for high-reliability, high thermal conductivity, die-attach applications, InFORCE29 features high workability, making it suitable for printing or dispensing applications. InFORCE29 provides excellent sinter performance on bare copper surfaces without the need for costly gold or silver plating.
- InFORCEMF a pressure silver sinter paste for the highest reliability, highest thermal conductivity, die-attach applications, InFORCEMF is specially formulated for printing applications providing low process yield loss due to print defects and reduces the need for overprint. With a high metal load and low organic content, it enables fast drying times and less material loss.
- Durafuse HT based on a novel alloy technology, designed to deliver a tin-rich, high-temperature lead-free (HTLF) paste, presenting the merits of both constituent alloys. Durafuse HT delivers simplified processing, with no special equipment needed, and enhanced thermal cycling reliability equal to or higher than a high-Pb solder.
To learn more about Indium Corporation’s solutions for power electronics, be sure to visit with our experts at PCIM Asia in hall W2, stand F25.
Informazioni su Indium Corporation
Indium Corporation è un'azienda leader nella raffinazione, fusione, produzione e fornitura di materiali per i mercati globali dell'elettronica, dei semiconduttori, dei film sottili e della gestione termica. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, bersagli per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil. Fondata nel 1934, l'azienda dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Germania, India, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
Per ulteriori informazioni su Indium Corporation, visitare www.indium.com o inviare un'e-mail a Jingya Huang. È inoltre possibile seguire i nostri esperti, From One Engineer To Another (#FOETA), all'indirizzo www.linkedin.com/company/indium-corporation/ o @IndiumCorp.
