Indium Corporation is set to deliver a technical presentation and exhibit its industry-leading products for power electronics assembly at PCIM Asia, August 29-31, in Shanghai, China.
Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation titled Innovative High-Temperature Lead-Free Die-Attach Soldering Materials and Applications. He will examine the characteristics, applications, and process optimization related to new high-temperature, lead-free materials and their reliability testing data.
Power semiconductors are the core of electric energy conversion and circuit control in electronic devices, and are widely used in new energy vehicles, energy storage, data centers, photovoltaics, and industrial applications. In response to industry changes, Indium Corporation has launched a number of innovative high-temperature lead-free solutions, such as new high-temperature lead-free solder paste, pressured and non-pressured silver sintering paste, and copper sintering materials for die-attach.
“The power density of the third-generation semiconductors represented by SiC has been greatly improved, and higher requirements are placed on the on-resistance, thermal conductivity and reliability of die-attach materials,” said Hu. “Combined with the exemption of high-lead solder expiring in 2024, it is imperative for the industry to evaluate new and innovative high-temperature, lead-free solutions.”
As Senior Area Technical Manager for East China, Hu manages the technical support team in East China, and collaborates with global technical support teams to provide Indium Corporation customers with product and application solutions. He has more than 15 years of experience in semiconductor packaging and possesses expertise in advanced assembly technology development, process improvement, and assembly materials applications. Hu earned a master’s degree in IC engineering from the Chinese Academy of Science and a bachelor’s degree in electronic information science and technology from Nankai University, Tianjin, China.
Indium Corporation’s products for power electronics have been demonstrated to reduce energy consumption and solve warpage issues for its customers while ensuring high reliability and improving overall efficiency.
Featured products include:
- InTACK是一种免清洗、无残留、无卤素的粘合剂解决方案，用于在贴片和回流焊过程中固定零件。InTACK 专为使用甲酸的无流体回流焊应用而设计，具有高粘性，可在不移动的情况下固定裸片、芯片或焊接预型件，减少对工具的依赖，同时不影响焊接或烧结质量。
- InFORMS reinforced solder alloy fabrications that improve mechanical and thermal reliability and are specifically designed to produce consistent bondline thickness for power module applications. They also address specific challenges for the power electronics industry by providing an enhanced material for the development of more reliable and higher performance modules.
- 用于预型件/InFORMS 的 Indalloy301LT 合金是一种新型无铅合金，与 SAC 合金相比，它能降低预型件焊接的加工温度。这种合金专为功率模块应用而设计，可防止在封装-冷却器连接情况下出现翘曲，而不会像传统的含铋低温合金那样牺牲可靠性。它可用于预型件、带状或 InFORMS 。
- InFORCE29 a pressure copper sinter paste for high-reliability, high thermal conductivity, die-attach applications, InFORCE29 features high workability, making it suitable for printing or dispensing applications. InFORCE29 provides excellent sinter performance on bare copper surfaces without the need for costly gold or silver plating.
- InFORCEMF a pressure silver sinter paste for the highest reliability, highest thermal conductivity, die-attach applications, InFORCEMF is specially formulated for printing applications providing low process yield loss due to print defects and reduces the need for overprint. With a high metal load and low organic content, it enables fast drying times and less material loss.
- Durafuse HT based on a novel alloy technology, designed to deliver a tin-rich, high-temperature lead-free (HTLF) paste, presenting the merits of both constituent alloys. Durafuse HT delivers simplified processing, with no special equipment needed, and enhanced thermal cycling reliability equal to or higher than a high-Pb solder.
To learn more about Indium Corporation’s solutions for power electronics, be sure to visit with our experts at PCIM Asia in hall W2, stand F25.
关于铟泰公司
Indium Corporation 是全球电子、半导体、薄膜和热管理市场的主要材料提炼商、冶炼商、制造商和供应商。产品包括焊料和助焊剂；钎料；热界面材料；溅射靶材；铟、镓、锗、锡金属和无机化合物；以及 NanoFoil 。公司成立于 1934 年，在中国、德国、印度、马来西亚、新加坡、韩国、英国和美国均设有工厂，并提供全球技术支持。
有关 Indium Corporation 的更多信息，请访问www.indium.com或发送电子邮件至Jingya Huang。您还可以通过www.linkedin.com/company/indium-corporation/或@IndiumCorp 关注我们的专家，From One Engineer To Another (#FOETA) 。
