Indium Corporation is set to deliver a technical presentation and exhibit its industry-leading products for power electronics assembly at PCIM Asia, August 29-31, in Shanghai, China.
Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation titled Innovative High-Temperature Lead-Free Die-Attach Soldering Materials and Applications. He will examine the characteristics, applications, and process optimization related to new high-temperature, lead-free materials and their reliability testing data.
Power semiconductors are the core of electric energy conversion and circuit control in electronic devices, and are widely used in new energy vehicles, energy storage, data centers, photovoltaics, and industrial applications. In response to industry changes, Indium Corporation has launched a number of innovative high-temperature lead-free solutions, such as new high-temperature lead-free solder paste, pressured and non-pressured silver sintering paste, and copper sintering materials for die-attach.
“The power density of the third-generation semiconductors represented by SiC has been greatly improved, and higher requirements are placed on the on-resistance, thermal conductivity and reliability of die-attach materials,” said Hu. “Combined with the exemption of high-lead solder expiring in 2024, it is imperative for the industry to evaluate new and innovative high-temperature, lead-free solutions.”
As Senior Area Technical Manager for East China, Hu manages the technical support team in East China, and collaborates with global technical support teams to provide Indium Corporation customers with product and application solutions. He has more than 15 years of experience in semiconductor packaging and possesses expertise in advanced assembly technology development, process improvement, and assembly materials applications. Hu earned a master’s degree in IC engineering from the Chinese Academy of Science and a bachelor’s degree in electronic information science and technology from Nankai University, Tianjin, China.
Los productos de Indium Corporation para electrónica de potencia han demostrado que reducen el consumo de energía y resuelven los problemas de alabeo de sus clientes, al tiempo que garantizan una alta fiabilidad y mejoran la eficiencia global.
Featured products include:
- InTACK es una solución adhesiva sin halógenos, sin residuos y sin necesidad de limpieza, desarrollada para mantener las piezas en su sitio durante los procesos de colocación y reflujo. Diseñado para su uso en aplicaciones de reflujo sin flujo con ácido fórmico, InTACK está especialmente formulado con alta adherencia para mantener un troquel, chip o preforma de soldadura en su lugar sin movimiento, reduciendo la dependencia de las herramientas sin comprometer la calidad de la soldadura o sinterización.
- InFORMS reinforced solder alloy fabrications that improve mechanical and thermal reliability and are specifically designed to produce consistent bondline thickness for power module applications. They also address specific challenges for the power electronics industry by providing an enhanced material for the development of more reliable and higher performance modules.
- Indalloy301 LT Aleación para Preformas/InFORMS una novedosa aleación sin Pb que permite temperaturas de proceso más bajas en la soldadura de preformas en comparación con las aleaciones SAC. Específicamente diseñada para aplicaciones de módulos de potencia, esta aleación evita el alabeo en situaciones de unión paquete-enfriador sin sacrificar la fiabilidad como ocurre con las aleaciones tradicionales de baja temperatura que contienen bismuto. Está disponible en preformas, cinta o InFORMS.
- InFORCE29 a pressure copper sinter paste for high-reliability, high thermal conductivity, die-attach applications, InFORCE29 features high workability, making it suitable for printing or dispensing applications. InFORCE29 provides excellent sinter performance on bare copper surfaces without the need for costly gold or silver plating.
- InFORCEMF a pressure silver sinter paste for the highest reliability, highest thermal conductivity, die-attach applications, InFORCEMF is specially formulated for printing applications providing low process yield loss due to print defects and reduces the need for overprint. With a high metal load and low organic content, it enables fast drying times and less material loss.
- Durafuse HT based on a novel alloy technology, designed to deliver a tin-rich, high-temperature lead-free (HTLF) paste, presenting the merits of both constituent alloys. Durafuse HT delivers simplified processing, with no special equipment needed, and enhanced thermal cycling reliability equal to or higher than a high-Pb solder.
To learn more about Indium Corporation’s solutions for power electronics, be sure to visit with our experts at PCIM Asia in hall W2, stand F25.
Acerca de Indium Corporation
Indium Corporation es un importante refinador, fundidor, fabricante y proveedor de materiales para los mercados mundiales de la electrónica, los semiconductores, las películas finas y la gestión térmica. Sus productos incluyen soldaduras y fundentes; soldaduras fuertes; materiales de interfaz térmica; cátodos para sputtering; metales y compuestos inorgánicos de indio, galio, germanio y estaño; y NanoFoil. Fundada en 1934, la empresa cuenta con asistencia técnica mundial y fábricas en China, Alemania, India, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
Para más información sobre Indium Corporation, visite www.indium.com o envíe un correo electrónico a Jingya Huang. También puede seguir a nuestros expertos, From One Engineer To Another (#FOETA), en www.linkedin.com/company/indium-corporation/ o @IndiumCorp.
