Applications PCB Assembly Package-on-Package

Package-On-Package Assembly

Package-on-package (PoP) assembly stacks silicon chips to maximize component density, making it ideal for compact devices like smartphones. Indium Corporation offers specialized expertise in PoP process technology, along with proven solder pastes and fluxes, to optimize motherboard space—enabling more powerful and energy-efficient devices.

Close-up of rows of small metallic spheres on a green surface, likely part of an electronic component.

High-Performance Materials for Efficient PoP Assembly

Top Precision

Our materials are engineered with ideal viscosity and rheology to ensure maximum transfer to component bumps while maintaining consistent volume.

High Yield

Advanced flux technology contributes to higher end-of-line yields by reducing defects and enhancing overall assembly quality.

Improved Wetting and Solderability

Excellent wettability and solderability are crucial for creating strong and reliable solder joints, ensuring the mechanical reliability and electrical performance of the assembled package.

Application Flexibility

Materials can be applied by dipping or dispensing, offering versatility in the assembly process and significant equipment cost savings by not requiring precise control of flux volume and reflow.

Related Markets

PoP technology is trusted across key markets for to its ability to enhance device performance while saving space.