Solder Ribbon and Foil

Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle from the chip to the system—from IC design, wafer fab,

Folks, This post is an excerpt on graping, fromIndium Corporation'sThe Printed Circuits Assemblers Guide to Solder Defects. Introduction The growth of personal electronic devices continues to

When the firsthigh-volume, automated, die-bonding machines for laser diode assembly were created, a single supplier dominated the market, providing all the solder materialneeded for this application.

Back in 2013, Carol Gowans was interviewed by Kalwinder Kaur for an article which appeared on AZO Materials’ website. The full article can be found

Here’s a question regarding samples of various alloys. “I am looking for small quantities of 8-10 different alloys to be used for testing at different temperatures. The test simply

Folks, Pity Ötzi, The Iceman, circa 3500BC. It is believed that he was involved in copper smelting as both copper particles and arsenic, a trace element in some copper ores, were found in his

Seth Homer: As discussed in video one of this four video series, there are three attach levels of peak concern in the IGBT stack up. By redefining how we use solder at the die-attach, DBC Substrate,

In a recent post we interviewed Shamaine Engler on the topic of cryogenic seal applications. As a follow-up, today we are speaking with Kim Flanagan (Technical Support Engineer) about specifying

Not all metals play well together. And this spills over in to the world of electronics and the materials used therein. A relatively new and relevant example came about with the advent of RoHS and the