Thermal Management

Achieving efficiency, reliability, and exceptional thermal performance is crucial in package-attach soldering applications for power modules. However, the high reflow temperatures required by

Folks, A short time ago,I posted"Metal TIMs 101: Chapter 1" with Jon Major. Now it is time for Chapter 2! Dr. Ron: Jon, what is TIM1.5? Jon: TIM1.5 commonly refers to the interface between

Folks, Dr. Ron: For my next several posts, I would like to chat with Indium Corporation’s metal thermal interface materials (TIMs) Product Manager, Jon Major, about metal TIMs. Jon, can you

Advanced packaging has continued to evolve with various interconnect technologies on their way towards heterogeneous

As we all know, finding thermal management solutions is becoming an increasingly critical but also an ever more challenging issue for the semiconductor industry as the power density increases while

Thermal managementis becoming an ever more critical challenge for semiconductor devices, as the functional density and power density increase – especially with advanced packaging. Thermal test

Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle from the chip to the system—from IC design, wafer fab,

Folks, Let’s look in on Ivy University Professor Patty Coleman as she chats with John Archer about Walter Isaacson’s biography of Elon Musk. “I have to admit, reading about

Folks, I was reading BBC’s Science Focus Magazine when I came across a reader’s letter to the editor in the October issue on page 12: “Reading the Q&A about fusion power