Products Sintering Materials Pressureless Sintering

Pressureless Sintering

Pressureless sintering is a versatile bonding process used in many applications. Sintered joints offer excellent thermal and electrical conductivity and can withstand high temperatures over 175°C. It’s also a lead-free alternative to traditional die-attach solders. Indium Corporation provides both silver and copper pressureless sinter pastes for reliable performance.

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  • High Metal/Low Organic Formulations
  • Ag and Cu Sinter Options
  • Lower Temperature 200°C Sintering (Ag)
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Suitable for Various Surface Finishes

Our pressureless silver (Ag) sinter paste is compatible with Ag, gold (Au), and copper (Cu) surfaces, while the Cu sinter paste suits Cu, Au, Ni, and Ag surfaces.

Ideal in High Temperatures

With melting points of 961°C for Ag and 1084°C for Cu, sintering is the perfect solution for applications where operating temperatures may exceed 175°C.

Lead-Free Die Attach Solution

Pressureless sintering offers a lead-free alternative to traditional Pb-based high-temperature solder pastes for semiconductor die attachment.

Low Processing Temperature

Pressureless sintering operates as a function of temperature over time. Indium Corporation’s Ag sinter paste can be processed at temperatures as low as 200°C.

Product Data Sheets

QuickSinter® InBake AgCu- Pressureless Ag Sinter Paste PDS 99969 (A4) R0.pdf
QuickSinter® InBake AgCu- Pressureless Ag Sinter Paste PDS 99969 R0.pdf

Related Applications

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