Applications
Package-Attach
To manage thermal load in power electronics systems, it’s essential to integrate the power module packaging with an effective cooling system. As mission profiles push for higher operating temperatures and power densities—especially in electric vehicle (EV) applications—designing the interface between the package and cooler becomes a critical factor. Key considerations when selecting materials for this package-to-cooler connection include thermal conductivity, mechanical strength, processing temperature, and lifecycle performance.
Overview
Right-Sized Solutions With a Suite of Package-Attach Materials
With a broad range of power module packaging, cooling system designs, and mission profiles, there is no one-size-fits-all package-attach alternative. From sinter pastes and InFORMS® solder preforms to Heat-Spring® thermal interface materials, Indium Corporation delivers solutions that balance performance, scalability, and cost-effectiveness.
Benefits
A Comprehensive Portfolio for Power Package-Attach
Superior Thermal Reliability
Indium Corporation’s metal-based thermal interface materials deliver a significant improvement over traditional organic options, offering up to 10 times higher thermal conductivity and reduced thermal resistance. Thermal conductivity ranges from over 40 W/mK with solder preforms to as high as 250 W/mK with sinter pastes.
Excellent Mechanical Reliability
Our materials offer robust mechanical properties to prevent fatigue and premature lifecycle failures, such as InFORCETM LA sintering technology, designed to tackle the challenges of extreme mission profiles.
Proven, Scalable, and Reliable
We leverage extensive experience in manufacturing solder preforms, pastes, and thermal interface materials for a variety of industries.
Lower Processing Temperature Available
Innovative alloy technology, such as Indalloy®301 LT, limits the thermal exposure of packaging during manufacturing, preventing internal delamination and warpage to extend system life.
Related Products
Our proven products help customers across industries increase yield and reduce time-to-market with reliable solutions.
InFORCE®
InFORCE Series sinter pastes excel in high-performance
Indalloy®301LT
Indalloy® 301LT offers versatile solder forms & enhances reliability with lower processing temperatures using InFORMS®
Heat-Spring®
A renowned soft metal alloy thermal interface
Related Applications
Power Electronics Packaging & Assembly
Extensive range of proven high-reliability solder and more
Thermal Management
Thermal solutions for HPC ensuring reliability and optimal
Related Markets
Package-attach is widely used by many industries.
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