Clip and Lead Frame Attach

In power electronics packaging, clip-attach and lead-frame attach are two methods used to bond pre-fabricated copper frames, enabling efficient internal and external interconnections. Clip-attach typically connects the top of the semiconductor die to the substrate, while lead-frame attach extends beyond the package to create external electrical connection terminals. The choice of bonding material is crucial for enhancing yield and overall performance.

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Close-up of a copper electrical component with multiple connectors on a green background.

Overview

Maximize Yields with Indium Corporation’s Portfolio

When choosing materials for clip-attach or lead-frame attach applications, it’s important to consider thermal and electrical conductivity, as well as melting temperature. Different package designs cater to various mission profiles, offering a range of options for these applications. Indium Corporation provides a comprehensive portfolio to meet your needs and enhance yield performance.

Benefits

Cutting-Edge Solutions from Indium Corporation

High Reliability

Enhance the reliability of your power electronics by choosing the optimal material. Indium Corporation provides solutions ranging from InFORMS® and high-reliability alloys to sintering materials.

Flux-Free Soldering

By utilizing preforms and InFORMS® specially designed for formic acid reflow processes, these flux-free solder systems eliminate the need for post-reflow cleaning.

Controlled Bond Line Thickness

InFORMS® reinforced preforms employ Indium’s matrix standoff design to consistently achieve a minimum bond line thickness (BLT), preventing stress concentration on the die surface and enhancing solder joint reliability.

Wide Alloy Selection

Indium Corporation offers a broad range of alloy options—in both Pb-based and Pb-free compositions—suitable for low- and high-temperature melting applications.