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Stages of a Reflow Profile: Part IV
Happy New Year everyone! Typically the new year signals a new beginning, but thispost will be concluding our series on reflow profilingby discussing the fourth stage of a reflow profile: the
A Precise Equation Relating Karats of Gold to Density in Gold Alloys
Folks, Some years ago I received the request below: Hi Dr. Lasky, I am a precious metals recycler and would very much appreciate your verifying the validity of an equation that approximates the Karat
Patty and the Professor Flashback: Uptime Part 4
Folks, the adventures of The Professor continue……… So far the meeting with The Professor had proven very valuable John thought.He was anxious to hear the other suggestions that The
The Professor’s second visit to ACME….. continued
"Well what should we do Professor?" John said weakly. "Clearly, not shut the line down over the lunch break," The Professor responded quickly. "We can't!"said John,
The Return of Patty and the Professor: Uptime Part 2
Folks, For the next few weeksI plan to repost some of the first Patty and the Professor episodes. As I visited several facilities, some of them in other industries, I found that uptime is as vital a
The Return of Patty and the Professor
Folks, I teach a course at Dartmouth on manufacturing processes: ENGM 185. In this course, I use many of the chapters from “The Adventures of Patty and the Professor.” This book started as a
Assured Solder Recycling Program
While Indium Corporation is well-knownas a solder supplier, it is less known for its ability to recycle solder.Indium Corporation’s solder reclaim program uses state-of-the-art electrolytic
Hypothesis Test Spreadsheet for Cpk of Stencil Printing Transfer Efficiency
Folks, It is accepted as fact by everyone that I know that 2/3rd of all SMT defects can be traced back to the stencil printing process. A number of us have tried to find a reference for this posit,
Stages of a Reflow Profile: Part III
In my previous post on this topic, Stages of a Reflow Profile: Part II, I mentioned a few profile-induced soldering defects, including graping, tombstoning, and voiding. In this post,we will talk
Gallium-Indium Liquid Metal Self-Healing Electronics, Part 5 of 5
This week we learned about an exciting new liquid metal-infused polymer, made with a gallium-indium alloy, which can be used to form circuits that heal themselves after being damaged. Today, Eric
Gallium-Indium Liquid Metal Self-Healing Electronics, Part 4 of 5
Over the last few days we have learned about how to create stretchable electronics from gallium and indium embedded into an elastomer. Today we continue the conversation with Eric Markvicka and look
Gallium-Indium Liquid Metal Self-Healing Electronics, Part 3 of 5
We are back again with Eric Markvicka to talk about how easy it is to form a stretchable electrical circuit with liquid metal-embedded material and some simple tools. Jim: Eric, at first blush your
Gallium-Indium Liquid Metal Self-Healing Electronics, Part 2 of 5
Yesterday Eric Markvicka demonstrated self-healing electronics for us with his video of a liquid metal embedded elastomer. Today, we discuss a composite material that is electrically insulating until
An Overview of Vacuum Reflow Soldering
Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, and Phil Zarrow, discuss how vacuum reflow soldering can be used to reduce voiding. Phil Zarrow: Brook, there's been a
Gallium-Indium Liquid Metal Self-Healing Electronics, Part 1 of 5
This week we will be discussing the future of self-healing electronics with Eric Markvicka of Carnegie Mellon University. At the time of writing this, Eric is a PhD Student working on his thesis:
Stages of a Reflow Profile: Part II
In my last post, Stages of a Reflow Profile: Part I, I discussed how thespattering of solder balls and solder paste slumping can occur in the beginning stages of a reflow profile. In this post I will
Stages of a Reflow Profile: Part I
Often times solder defects such as spattering, voiding, slumping/bridging, and tombstoning can be remedied just by adjusting the reflow profile. For this reason it is important to understand the
How much flux should I use in my solder wire?
Your first consideration when determining how much flux to use in your solder wire is whether you are doing hand soldering or robotic soldering. Robotic soldering requires a greater flux percent than
Soldering 101: The Simplicity of Soldering – The Complexity of Solder Paste
Folks, Soldering copper to copper with a tin-based solder, such as tin-lead eutectic solder or a common lead-free solder like SAC305, requires only the liquid solder and copper to form the tin-copper
Soldering 101: II: The Miracle of Soldering
Folks, Pity Ötzi, The Iceman, circa 3500BC. It is believed that he was involved in copper smelting as both copper particles and arsenic, a trace element in some copper ores, were found in his
Gallium-Indium Alloys for Mechanical Uses (Liquid at Room Temperature)
In a previous post I mentioned some non-solder uses for low melting point alloys – meaning that they are used for purposes other than simply “joining two surfaces with a filler
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