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Stages of a Reflow Profile: Part IV
Happy New Year everyone! Typically the new year signals a new beginning, but thispost will be concluding our series on reflow profilingby discussing the fourth stage of a reflow profile: the
金のカラットと金合金の密度との正確な関係式
皆さん、何年か前に以下のような依頼を受けました:私は貴金属のリサイクル業者ですが、カラットを近似する方程式の妥当性を検証していただけるとありがたいです。
Patty and the Professor Flashback: Uptime Part 4
Folks, the adventures of The Professor continue……… So far the meeting with The Professor had proven very valuable John thought.He was anxious to hear the other suggestions that The
The Professor’s second visit to ACME….. continued
"Well what should we do Professor?" John said weakly. "Clearly, not shut the line down over the lunch break," The Professor responded quickly. "We can't!"said John,
パティと教授の帰還アップタイム パート2
皆さん、これから数週間、パティと教授の最初のエピソードを再掲載する予定です。いくつかの施設(中には異業種の施設もあった)を訪問して感じたのは、アップタイムというのは、その施設にとって極めて重要な要素であるということだ。
The Return of Patty and the Professor
Folks, I teach a course at Dartmouth on manufacturing processes: ENGM 185. In this course, I use many of the chapters from “The Adventures of Patty and the Professor.” This book started as a
Hypothesis Test Spreadsheet for Cpk of Stencil Printing Transfer Efficiency
Folks, It is accepted as fact by everyone that I know that 2/3rd of all SMT defects can be traced back to the stencil printing process. A number of us have tried to find a reference for this posit,
Stages of a Reflow Profile: Part III
In my previous post on this topic, Stages of a Reflow Profile: Part II, I mentioned a few profile-induced soldering defects, including graping, tombstoning, and voiding. In this post,we will talk
Gallium-Indium Liquid Metal Self-Healing Electronics, Part 5 of 5
This week we learned about an exciting new liquid metal-infused polymer, made with a gallium-indium alloy, which can be used to form circuits that heal themselves after being damaged. Today, Eric
Gallium-Indium Liquid Metal Self-Healing Electronics, Part 4 of 5
Over the last few days we have learned about how to create stretchable electronics from gallium and indium embedded into an elastomer. Today we continue the conversation with Eric Markvicka and look
Gallium-Indium Liquid Metal Self-Healing Electronics, Part 3 of 5
We are back again with Eric Markvicka to talk about how easy it is to form a stretchable electrical circuit with liquid metal-embedded material and some simple tools. Jim: Eric, at first blush your
Gallium-Indium Liquid Metal Self-Healing Electronics, Part 2 of 5
Yesterday Eric Markvicka demonstrated self-healing electronics for us with his video of a liquid metal embedded elastomer. Today, we discuss a composite material that is electrically insulating until
真空リフローはんだ付けの概要
PCBアセンブリマテリアルのテクニカルサポートエンジニア、ブルック・サンディ=スミスとフィル・ザローが、真空リフローはんだ付けによるボイド低減について語ります。フィル・ザローブルック
Gallium-Indium Liquid Metal Self-Healing Electronics, Part 1 of 5
This week we will be discussing the future of self-healing electronics with Eric Markvicka of Carnegie Mellon University. At the time of writing this, Eric is a PhD Student working on his thesis:
リフロープロファイルの段階:パートII
前回の投稿「リフロー・プロファイルの段階:パート1)では、リフロープロファイルの初期段階で、はんだボールの飛散やはんだペーストのスランプがどのように発生するかを説明しました。今回の投稿では
リフロープロファイルの段階:パート
Often times solder defects such as spattering, voiding, slumping/bridging, and tombstoning can be remedied just by adjusting the reflow profile. For this reason it is important to understand the
ハンダ線にフラックスはどのくらい使うべきですか?
Your first consideration when determining how much flux to use in your solder wire is whether you are doing hand soldering or robotic soldering. Robotic soldering requires a greater flux percent than
Soldering 101: The Simplicity of Soldering – The Complexity of Solder Paste
Folks, Soldering copper to copper with a tin-based solder, such as tin-lead eutectic solder or a common lead-free solder like SAC305, requires only the liquid solder and copper to form the tin-copper
はんだ付け入門:II:はんだ付けの奇跡
皆さん、紀元前3500年頃の氷人エッツィに同情してください。銅の粒子と、銅鉱石に含まれる微量元素であるヒ素の両方が発見されたことから、彼は銅の製錬に携わっていたと考えられている。
Gallium-Indium Alloys for Mechanical Uses (Liquid at Room Temperature)
In a previous post I mentioned some non-solder uses for low melting point alloys – meaning that they are used for purposes other than simply “joining two surfaces with a filler
お困りですか?
インジウムでは、今日、明日、そして未来の課題に対する高度なエレクトロニクス組立材料のソリューションを研究、開発、製造しています。

