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前回の投稿「リフロー・プロファイルの段階：パート1）では、リフロープロファイルの初期段階で、はんだボールの飛散やはんだペーストのスランプがどのように発生するかを説明しました。今回の投稿では

Often times solder defects such as spattering, voiding, slumping/bridging, and tombstoning can be remedied just by adjusting the reflow profile. For this reason it is important to understand the

Your first consideration when determining how much flux to use in your solder wire is whether you are doing hand soldering or robotic soldering. Robotic soldering requires a greater flux percent than

Folks, Soldering copper to copper with a tin-based solder, such as tin-lead eutectic solder or a common lead-free solder like SAC305, requires only the liquid solder and copper to form the tin-copper

皆さん、紀元前3500年頃の氷人エッツィに同情してください。銅の粒子と、銅鉱石に含まれる微量元素であるヒ素の両方が発見されたことから、彼は銅の製錬に携わっていたと考えられている。

In a previous post I mentioned some non-solder uses for low melting point alloys – meaning that they are used for purposes other than simply “joining two surfaces with a filler

みなさん、はんだ付けは古代の技術です。はんだ付けが最初に発見されたのは紀元前4000年前と推定されています。つまり、ユリウス・カエサル（紀元前100年～紀元前44年）にとっては、はんだ付けの方がはるかに古い技術だったわけだ。

Folks, Patty, Pete, Rob and the Professor were having their weekly book club meeting. As they were wrapping up, Patty said, “Remember about a month ago we talked about using an SMT Pretest

Patty was excited about today’s book club meeting with, “The Boys.” She had started calling her husband Rob, her former co-worker at ACME and now research technologist at Ivy U,

Folks, My good friends, Phil Zarrow and Jim Hall, in their award-winning audio series “Board Talk,” were recently asked about the “Five Ball Rule”. In the comments section for

Folks, Let’s see how Patty is doing, it’s been a very, very long time… Even though Patty and her husband Rob both worked at Ivy University, they seldom drove in together. It was

フィル・ザローロバート：プロセス特性評価の業界標準はCpkで、Cpuの場合もあります。材料に関しては、

I just read an article published on an SMT-focused website by Paul Socha. Mr. Socha was the Manager of Applications Engineering for many years and was instrumental in creating the group that Indium

フィル・ザローエリック、表面絶縁抵抗（SIR）の話題です。それは一体何なのでしょうか？私たちはここで何をしているのでしょうか？エリック・バストウまあ、簡単に言えば、電気的な信頼性を測定しているわけです。

The tremendous increase in the use of bottom terminated components (BTCs), some estimates are at more than 50 billion per year, have heightened the concern for minimizing voiding between the thermal

Robotic Soldering II After reading my last post on robotic soldering, you have decided that you have a good robotic soldering application and want to get started. You have also decided that you will

これまで低温はんだ合金と特にインジウムについて見てきました。今度は高温はんだとろう付け合金のオプションを見てみましょう。バーニー・リーヴィットは当社のシニア・プロダクト

Phil Zarrow: Brook, we've discussed handling solder paste from the refrigerator to the stencil printer, but there's a lot more to this story, particularly from the factory to the customer.

Most articles I have read regarding Thermal Interface Materials (TIMs) focus on one application. Others generally focus on only one material (the material the author is promoting). In the case of a

適切な用途に適切なはんだ合金」についての最初の投稿では、ビスマスやインジウムを含む合金を含む低温はんだ合金全般について説明しました。今回の投稿では

Promation Robotic Soldering Unit Folks, There is currently considerable interest in robotic soldering, with good reason. Robotic soldering can increase productivity and profitability, but it must be