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Happy New Year everyone! Typically the new year signals a new beginning, but thispost will be concluding our series on reflow profilingby discussing the fourth stage of a reflow profile: the

Amigos, hace algunos años recibí la siguiente solicitud: Hola Dr. Lasky, soy un reciclador de metales preciosos y le agradecería mucho que verificara la validez de una ecuación que aproxima el Karat

Folks, the adventures of The Professor continue……… So far the meeting with The Professor had proven very valuable John thought.He was anxious to hear the other suggestions that The

"Well what should we do Professor?" John said weakly. "Clearly, not shut the line down over the lunch break," The Professor responded quickly. "We can't!"said John,

Amigos, en las próximas semanas pienso volver a publicar algunos de los primeros episodios de Patty y el Profesor. Mientras visitaba varias instalaciones, algunas de ellas en otras industrias, me di cuenta de que el tiempo de actividad es un factor tan vital como la seguridad.

Folks, I teach a course at Dartmouth on manufacturing processes: ENGM 185. In this course, I use many of the chapters from “The Adventures of Patty and the Professor.” This book started as a

Aunque Indium Corporation es conocida como proveedora de soldaduras, no lo es tanto por su capacidad para reciclarlas.

Folks, It is accepted as fact by everyone that I know that 2/3rd of all SMT defects can be traced back to the stencil printing process. A number of us have tried to find a reference for this posit,

In my previous post on this topic, Stages of a Reflow Profile: Part II, I mentioned a few profile-induced soldering defects, including graping, tombstoning, and voiding. In this post,we will talk

This week we learned about an exciting new liquid metal-infused polymer, made with a gallium-indium alloy, which can be used to form circuits that heal themselves after being damaged. Today, Eric

Over the last few days we have learned about how to create stretchable electronics from gallium and indium embedded into an elastomer. Today we continue the conversation with Eric Markvicka and look

We are back again with Eric Markvicka to talk about how easy it is to form a stretchable electrical circuit with liquid metal-embedded material and some simple tools. Jim: Eric, at first blush your

Yesterday Eric Markvicka demonstrated self-healing electronics for us with his video of a liquid metal embedded elastomer. Today, we discuss a composite material that is electrically insulating until

Brook Sandy-Smith, Ingeniero de Soporte Técnico de PCB Assembly Materials, y Phil Zarrow, discuten cómo puede utilizarse la soldadura por reflujo en vacío para reducir el voiding. Phil Zarrow: Brook, ha habido un

This week we will be discussing the future of self-healing electronics with Eric Markvicka of Carnegie Mellon University. At the time of writing this, Eric is a PhD Student working on his thesis:

En mi último post, Etapas de un perfil de reflujo: Parte I, hablé de cómo la dispersión de las bolas de soldadura y el desprendimiento de la pasta de soldadura pueden ocurrir en las etapas iniciales de un perfil de reflujo. En este artículo

Often times solder defects such as spattering, voiding, slumping/bridging, and tombstoning can be remedied just by adjusting the reflow profile. For this reason it is important to understand the

Your first consideration when determining how much flux to use in your solder wire is whether you are doing hand soldering or robotic soldering. Robotic soldering requires a greater flux percent than

Folks, Soldering copper to copper with a tin-based solder, such as tin-lead eutectic solder or a common lead-free solder like SAC305, requires only the liquid solder and copper to form the tin-copper

Amigos, compadezcan a Ötzi, el hombre de hielo, circa 3500 AC. Se cree que se dedicaba a la fundición de cobre, ya que en su cuerpo se encontraron partículas de cobre y arsénico, un oligoelemento presente en algunos minerales de cobre.

In a previous post I mentioned some non-solder uses for low melting point alloys – meaning that they are used for purposes other than simply “joining two surfaces with a filler