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Stages of a Reflow Profile: Part II
In my last post, Stages of a Reflow Profile: Part I, I discussed how thespattering of solder balls and solder paste slumping can occur in the beginning stages of a reflow profile. In this post I will
Stages of a Reflow Profile: Part I
Often times solder defects such as spattering, voiding, slumping/bridging, and tombstoning can be remedied just by adjusting the reflow profile. For this reason it is important to understand the
How much flux should I use in my solder wire?
Your first consideration when determining how much flux to use in your solder wire is whether you are doing hand soldering or robotic soldering. Robotic soldering requires a greater flux percent than
Soldering 101: The Simplicity of Soldering – The Complexity of Solder Paste
Folks, Soldering copper to copper with a tin-based solder, such as tin-lead eutectic solder or a common lead-free solder like SAC305, requires only the liquid solder and copper to form the tin-copper
Gallium-Indium Alloys for Mechanical Uses (Liquid at Room Temperature)
In a previous post I mentioned some non-solder uses for low melting point alloys – meaning that they are used for purposes other than simply “joining two surfaces with a filler
Using a Math PreTest Before Giving a Lean Six Sigma Workshop
Folks, Patty, Pete, Rob and the Professor were having their weekly book club meeting. As they were wrapping up, Patty said, “Remember about a month ago we talked about using an SMT Pretest
Math PreTest for Lean Six Sigma
Patty was excited about today’s book club meeting with, “The Boys.” She had started calling her husband Rob, her former co-worker at ACME and now research technologist at Ivy U,
Does Solder Paste’s “Five Ball Rule” Remain Valid in SMT Today?
Folks, My good friends, Phil Zarrow and Jim Hall, in their award-winning audio series “Board Talk,” were recently asked about the “Five Ball Rule”. In the comments section for
Use an SMT Pre-Test Before Presenting a Soldering Workshop
Folks, Let’s see how Patty is doing, it’s been a very, very long time… Even though Patty and her husband Rob both worked at Ivy University, they seldom drove in together. It was
10 Basic Steps When Choosing Solder Preforms
I just read an article published on an SMT-focused website by Paul Socha. Mr. Socha was the Manager of Applications Engineering for many years and was instrumental in creating the group that Indium
Surface Insulation Resistance (SIR) and Flux Designation (ROL) Defined
Phil Zarrow: Eric, the topic of surface insulation resistance, SIR. What exactly is it? What are we doing here? Eric Bastow: Well, simply put you are measuring the electrical reliability of a
Tips for Successfully Using Vacuum Reflow Ovens in SMT Soldering
The tremendous increase in the use of bottom terminated components (BTCs), some estimates are at more than 50 billion per year, have heightened the concern for minimizing voiding between the thermal
Robotic Soldering II
Robotic Soldering II After reading my last post on robotic soldering, you have decided that you have a good robotic soldering application and want to get started. You have also decided that you will
如何管理最坏的运输情况
Phil Zarrow: Brook, we've discussed handling solder paste from the refrigerator to the stencil printer, but there's a lot more to this story, particularly from the factory to the customer.
Electronics Cooling Article Discusses Variety of Thermal Interface (TIM) Applications
Most articles I have read regarding Thermal Interface Materials (TIMs) focus on one application. Others generally focus on only one material (the material the author is promoting). In the case of a
Robotic Soldering I
Promation Robotic Soldering Unit Folks, There is currently considerable interest in robotic soldering, with good reason. Robotic soldering can increase productivity and profitability, but it must be
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