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Stages of a Reflow Profile: Part IV

Happy New Year everyone! Typically the new year signals a new beginning, but thispost will be concluding our series on reflow profilingby discussing the fourth stage of a reflow profile: the

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黃金克拉數與黃金合金密度的精確等式

各位,幾年前我收到以下的請求:您好,Lasky 博士,我是一位貴金屬回收商,非常感謝您驗證一個近似克拉數的方程式的有效性。

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Patty and the Professor Flashback: Uptime Part 4

Folks, the adventures of The Professor continue……… So far the meeting with The Professor had proven very valuable John thought.He was anxious to hear the other suggestions that The

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The Professor’s second visit to ACME….. continued

"Well what should we do Professor?" John said weakly. "Clearly, not shut the line down over the lunch break," The Professor responded quickly. "We can't!"said John,

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帕蒂和教授的回歸Uptime 第 2 部分

各位,在接下來的幾個星期裡,我打算重貼一些第一集 Patty and the Professor 的內容。我參觀了幾個設施,其中有些是其他行業的,我發現正常運行時間是一個非常重要的因素。

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The Return of Patty and the Professor

Folks, I teach a course at Dartmouth on manufacturing processes: ENGM 185. In this course, I use many of the chapters from “The Adventures of Patty and the Professor.” This book started as a

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保證焊錫回收計劃

儘管 Indium Corporation 是知名的焊料供應商,但其回收焊料的能力卻鮮有人知。

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Hypothesis Test Spreadsheet for Cpk of Stencil Printing Transfer Efficiency

Folks, It is accepted as fact by everyone that I know that 2/3rd of all SMT defects can be traced back to the stencil printing process. A number of us have tried to find a reference for this posit,

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Stages of a Reflow Profile: Part III

In my previous post on this topic, Stages of a Reflow Profile: Part II, I mentioned a few profile-induced soldering defects, including graping, tombstoning, and voiding. In this post,we will talk

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Gallium-Indium Liquid Metal Self-Healing Electronics, Part 5 of 5

This week we learned about an exciting new liquid metal-infused polymer, made with a gallium-indium alloy, which can be used to form circuits that heal themselves after being damaged. Today, Eric

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Gallium-Indium Liquid Metal Self-Healing Electronics, Part 4 of 5

Over the last few days we have learned about how to create stretchable electronics from gallium and indium embedded into an elastomer. Today we continue the conversation with Eric Markvicka and look

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Gallium-Indium Liquid Metal Self-Healing Electronics, Part 3 of 5

We are back again with Eric Markvicka to talk about how easy it is to form a stretchable electrical circuit with liquid metal-embedded material and some simple tools. Jim: Eric, at first blush your

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Gallium-Indium Liquid Metal Self-Healing Electronics, Part 2 of 5

Yesterday Eric Markvicka demonstrated self-healing electronics for us with his video of a liquid metal embedded elastomer. Today, we discuss a composite material that is electrically insulating until

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真空回流焊概述

PCB 組裝材料技術支援工程師 Brook Sandy-Smith 和 Phil Zarrow 討論如何利用真空回流焊來減少空洞。Phil Zarrow:Brook, 有一個

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Gallium-Indium Liquid Metal Self-Healing Electronics, Part 1 of 5

This week we will be discussing the future of self-healing electronics with Eric Markvicka of Carnegie Mellon University. At the time of writing this, Eric is a PhD Student working on his thesis:

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回流剖面的階段:第二部分

在我的上一篇文章《回流剖面的各個階段》(Stages of a Reflow Profile:第一部分中,我討論了在回流剖面的開始階段如何發生焊球飛散和焊膏坍塌。在這篇文章中,我將

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回流剖面的階段:第一部分

Often times solder defects such as spattering, voiding, slumping/bridging, and tombstoning can be remedied just by adjusting the reflow profile. For this reason it is important to understand the

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焊錫線中應該使用多少助焊劑?

Your first consideration when determining how much flux to use in your solder wire is whether you are doing hand soldering or robotic soldering. Robotic soldering requires a greater flux percent than

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Soldering 101: The Simplicity of Soldering – The Complexity of Solder Paste

Folks, Soldering copper to copper with a tin-based solder, such as tin-lead eutectic solder or a common lead-free solder like SAC305, requires only the liquid solder and copper to form the tin-copper

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焊接 101:II:焊接的奇蹟

各位,請同情約公元前 3500 年的冰人 Ötzi。據說他曾參與銅冶煉,因為在他的身上發現了銅粒和砷,砷是某些銅礦石的微量元素。

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Gallium-Indium Alloys for Mechanical Uses (Liquid at Room Temperature)

In a previous post I mentioned some non-solder uses for low melting point alloys – meaning that they are used for purposes other than simply “joining two surfaces with a filler

在 Indium,我們研究、開發並製造先進的電子組裝材料解決方案,以因應今日、明日及未來的挑戰。