部落格

在我的上一篇文章《回流剖面的各個階段》（Stages of a Reflow Profile：第一部分中，我討論了在回流剖面的開始階段如何發生焊球飛散和焊膏坍塌。在這篇文章中，我將

Often times solder defects such as spattering, voiding, slumping/bridging, and tombstoning can be remedied just by adjusting the reflow profile. For this reason it is important to understand the

Your first consideration when determining how much flux to use in your solder wire is whether you are doing hand soldering or robotic soldering. Robotic soldering requires a greater flux percent than

Folks, Soldering copper to copper with a tin-based solder, such as tin-lead eutectic solder or a common lead-free solder like SAC305, requires only the liquid solder and copper to form the tin-copper

各位，請同情約公元前 3500 年的冰人 Ötzi。據說他曾參與銅冶煉，因為在他的身上發現了銅粒和砷，砷是某些銅礦石的微量元素。

In a previous post I mentioned some non-solder uses for low melting point alloys – meaning that they are used for purposes other than simply “joining two surfaces with a filler

各位，焊接是一種古老的技術。據估計，焊接最早是在公元前 4000 年被發現的。因此，對於凱撒大帝 (Julius Caesar, 公元前 100 - 公元前 44) 來說，焊接的歷史遠遠超過了他的祖先。

Folks, Patty, Pete, Rob and the Professor were having their weekly book club meeting. As they were wrapping up, Patty said, “Remember about a month ago we talked about using an SMT Pretest

Patty was excited about today’s book club meeting with, “The Boys.” She had started calling her husband Rob, her former co-worker at ACME and now research technologist at Ivy U,

Folks, My good friends, Phil Zarrow and Jim Hall, in their award-winning audio series “Board Talk,” were recently asked about the “Five Ball Rule”. In the comments section for

Folks, Let’s see how Patty is doing, it’s been a very, very long time… Even though Patty and her husband Rob both worked at Ivy University, they seldom drove in together. It was

Phil Zarrow：Robert，製程特性的業界標準是 Cpk，有時也是 Cpu；Lasky 博士已討論過這一點，因為它與組裝製程有關。至於材料方面、

I just read an article published on an SMT-focused website by Paul Socha. Mr. Socha was the Manager of Applications Engineering for many years and was instrumental in creating the group that Indium

Phil Zarrow：Eric, 關於表面絕緣電阻，SIR。它到底是什麼？我們在這裡做什麼？Eric Bastow：簡單來說，您是在測量電路的可靠性。

The tremendous increase in the use of bottom terminated components (BTCs), some estimates are at more than 50 billion per year, have heightened the concern for minimizing voiding between the thermal

Robotic Soldering II After reading my last post on robotic soldering, you have decided that you have a good robotic soldering application and want to get started. You have also decided that you will

我們已經有機會了解低溫焊料合金，特別是铟。現在是時候來看看高溫焊料和銅焊合金的選擇。Bernie Leavitt 是我們的高級產品經理。

Phil Zarrow: Brook, we've discussed handling solder paste from the refrigerator to the stencil printer, but there's a lot more to this story, particularly from the factory to the customer.

Most articles I have read regarding Thermal Interface Materials (TIMs) focus on one application. Others generally focus on only one material (the material the author is promoting). In the case of a

在第一篇關於「適合應用的焊料合金」的文章中，我們討論了一般的低溫焊料合金，包括含鉍和含铟合金。在這篇文章中，我們將

Promation Robotic Soldering Unit Folks, There is currently considerable interest in robotic soldering, with good reason. Robotic soldering can increase productivity and profitability, but it must be