Semiconductor Fluxes: Part 3
Part 3 of the semiconductor flux series talks about the important cleaning function of fluxes and how thermocompression bonding can help prevent warpa...
Semiconductor Packaging
Semiconductor Fluxes: Part 2
This is the second in a series of posts about semiconductor fluxes, and talks about the optimal dipping depth for flip-chip fluxes....
Semiconductor Fluxes: Part 1
If you are a little intimidated by semiconductor products, this blog post provides a simple explanation to help you better understand these products....
Driving the Packaging Frontier: Part 2
Indium Corporation’s Sze Pei Lim, talks about when to make th emove from water-soluble to no-clean fluxes for flip-chip assembly packages....
Evolving Semiconductor Assembly Challenges in 2019
2019 predictions for semiductor packaging and assembly based on global uncertainty on political and economic fronts....
Metal Loading in Solder Paste - A Review (Part 1)
Three IPC test methods are used to guarantee to customers that they are getting the same material (within agreed tolerances). However o...
Dartmouth Student Asks Questions About SACm® Solder Alloy
Folks, Some years ago, a leading IC manufacturer decided that their R&D effort could benefit if analyzed for possible improvement – by hirin...
Ronnie Spraker and the World’s Only NanoFoil®/NanoBond® Production Team
Ronnie Spraker is the supervisor of our NanoFoil® production department. Everyday, Ronnie and his team make reactive foils that are used all over ...
RDSON and Solder Volume Resistivity
Interesting question from a Chinese die-attach customer this week asking about volume resistivity of solder. My friend, Eric Bastow, suggested that In...
Marcy Nanocenter Semiconductor Fab
You may remember that, a couple of years ago, I wrote an article for Chip Scale Review magazine about plans for a major semiconductor facility (the Ma...
Manufacturing Indium with Pride
I recently caught up with Brent Boek, Supervisor of the indium cell at our Utica Business Park manufacturing facility in New York. Brent and his crew ...
Leadframe Solderability Issues in Power Semiconductors
It is no secret that automotive semiconductor customers are becoming increasingly demanding. The “under the hood / bonnet” electronics env...