Semiconductor Packaging
SiP Printing 101 Webinar Preview: Stencil Technology
Stencil technology has evolved throughout the years, and System-in-Package solder pastes require specific stencil manufacturing processes and novel te...
SiP Printing 101 Webinar Preview: Solder Paste Inspection
Just as important in the solder paste printing process is solder paste inspection; how do you know if your printer is operating optimally if your SPI ...
SiP Printing 101 Webinar Preview: Water Soluble vs. No-Clean Pastes
Choosing the correct solder paste formulation is critical for System-in-Package assembly. Indium Corporation's SiPaste® solder pastes offer a ...
Common Ball Grid Array Failures and How to Avoid Them
The BGA ball-mount process may seem uninteresting and trivial at first glance. However, the soldering steps are complex and can lead to problematic fa...
WS-446HF Wetting: No Substrate Is Too Tough
There are many different substrates that are used in the electronics industry, and some are more challenging to solder than others. Indium Corporation...
How Does the Rheology of WS-446HF Enable One-Step Cleaning?
The rheology of a flux is very important with respect to the applications of a flux. WS-446HF has a stable rheology which makes it a good choice for b...
WS-446HF: A One-Step Cleaning Flux
Indium Corporation’s water-soluble flux, WS-446HF, is designed to eliminate non-value-added process costs of prefluxing steps, turning “tw...
Semiconductor Fluxes: Part 3
Part 3 of the semiconductor flux series talks about the important cleaning function of fluxes and how thermocompression bonding can help prevent warpa...
Semiconductor Fluxes: Part 2
This is the second in a series of posts about semiconductor fluxes, and talks about the optimal dipping depth for flip-chip fluxes....
Semiconductor Fluxes: Part 1
If you are a little intimidated by semiconductor products, this blog post provides a simple explanation to help you better understand these products....
Driving the Packaging Frontier: Part 2
Indium Corporation’s Sze Pei Lim, talks about when to make th emove from water-soluble to no-clean fluxes for flip-chip assembly packages....