Posted On: August 29th, 2019 | By: Dr. Andy Mackie

Driving the Packaging Frontier: Part 2

Indium Corporation’s Sze Pei Lim, talks about when to make th emove from water-soluble to no-clean fluxes for flip-chip assembly packages....

Posted On: January 4th, 2019 | By: Dr. Andy Mackie

Evolving Semiconductor Assembly Challenges in 2019

2019 predictions for semiductor packaging and assembly based on global uncertainty on political and economic fronts....

Posted On: December 28th, 2015 | By: Dr. Andy Mackie

Metal Loading in Solder Paste - A Review (Part 1)

Three IPC test methods are used to guarantee to customers that they are getting the same material (within agreed tolerances). However o...

Posted On: December 13th, 2013 | By: Dr. Ron Lasky

Dartmouth Student Asks Questions About SACm® Solder Alloy

Folks, Some years ago, a leading IC manufacturer decided that their R&D effort could benefit if analyzed for possible improvement – by hirin...

Posted On: November 26th, 2013 | By: Jim Hisert

Ronnie Spraker and the World’s Only NanoFoil®/NanoBond® Production Team

Ronnie Spraker is the supervisor of our NanoFoil® production department. Everyday, Ronnie and his team make reactive foils that are used all over ...

Posted On: November 5th, 2013 | By: Dr. Andy Mackie

RDSON and Solder Volume Resistivity

Interesting question from a Chinese die-attach customer this week asking about volume resistivity of solder. My friend, Eric Bastow, suggested that In...

Posted On: September 23rd, 2013 | By: Dr. Andy Mackie

Marcy Nanocenter Semiconductor Fab

You may remember that, a couple of years ago, I wrote an article for Chip Scale Review magazine about plans for a major semiconductor facility (the Ma...

Posted On: August 22nd, 2013 | By: Jim Hisert

Manufacturing Indium with Pride

I recently caught up with Brent Boek, Supervisor of the indium cell at our Utica Business Park manufacturing facility in New York. Brent and his crew ...