Posted On: August 21st, 2021 | By: Evan Griffith

SiP Printing 101 Webinar Preview: Stencil Technology

Stencil technology has evolved throughout the years, and System-in-Package solder pastes require specific stencil manufacturing processes and novel te...

Posted On: August 20th, 2021 | By: Evan Griffith

SiP Printing 101 Webinar Preview: Solder Paste Inspection

Just as important in the solder paste printing process is solder paste inspection; how do you know if your printer is operating optimally if your SPI ...

Posted On: August 19th, 2021 | By: Evan Griffith

SiP Printing 101 Webinar Preview: Water Soluble vs. No-Clean Pastes

Choosing the correct solder paste formulation is critical for System-in-Package assembly. Indium Corporation's SiPaste® solder pastes offer a ...

Posted On: July 19th, 2021 | By: Evan Griffith

Common Ball Grid Array Failures and How to Avoid Them

The BGA ball-mount process may seem uninteresting and trivial at first glance. However, the soldering steps are complex and can lead to problematic fa...

Posted On: January 13th, 2021 | By: Evan Griffith

WS-446HF Wetting: No Substrate Is Too Tough

There are many different substrates that are used in the electronics industry, and some are more challenging to solder than others. Indium Corporation...

Posted On: January 12th, 2021 | By: Evan Griffith

How Does the Rheology of WS-446HF Enable One-Step Cleaning?

The rheology of a flux is very important with respect to the applications of a flux. WS-446HF has a stable rheology which makes it a good choice for b...

Posted On: January 11th, 2021 | By: Evan Griffith

WS-446HF: A One-Step Cleaning Flux

Indium Corporation’s water-soluble flux, WS-446HF, is designed to eliminate non-value-added process costs of prefluxing steps, turning “tw...

Posted On: October 21st, 2019 | By: Indium Corporation®

Semiconductor Fluxes: Part 3

Part 3 of the semiconductor flux series talks about the important cleaning function of fluxes and how thermocompression bonding can help prevent warpa...

Posted On: October 17th, 2019 | By: Indium Corporation®

Semiconductor Fluxes: Part 2

This is the second in a series of posts about semiconductor fluxes, and talks about the optimal dipping depth for flip-chip fluxes....

Posted On: October 15th, 2019 | By: Indium Corporation®

Semiconductor Fluxes: Part 1

If you are a little intimidated by semiconductor products, this blog post provides a simple explanation to help you better understand these products....