Indium Corporation’s Iván Castellanos, Technical Services Manager for Latin America, will host an Avoid the Void® InSIDER Series workshop on how to avoid voiding in bottom termination components (BTCs) on Tuesday, September 22 at 12 p.m. Central Time (Mexico)/7 p.m. Central European Summer Time (Madrid, Spain).
BTCs are one of the most common packages in electronics today with the highest growth rate due to their small size, excellent electrical performance, and ability to transfer heat away from the integrated circuit (IC). In this workshop, Understand and Troubleshoot Voiding in Bottom Terminated Components, Castellanos will discuss how voids form in QFNs and how to minimize them. He’ll also cover factors that affect voiding, such as stencil design, stencil thickness, reflow profile, solder paste particle size, and solder pastes. The use of solder preforms to minimize voiding will also be presented.
Die InSIDER-Reihe der Indium Corporation ist ein kostenloses Programm, das darauf abzielt, über eine virtuelle Plattform fachliche Inhalte zu vermitteln, Branchenwissen weiterzugeben und die berufliche Weiterentwicklung zu fördern. Aktuelle und zukünftige Webinare finden Sie unter www.indium.com/webinar.
Castellanos provides support for electronics assembly, semiconductor and advanced assembly, and thermal management markets. He is based in Guadalajara, Jalisco, Mexico, and has more than 25 years of experience in electronics assembly manufacturing, including SMT production troubleshooting. Castellanos has a diploma in electronics and communications engineering and is a Certified SMT Process Engineer (CSMTPE). He is the SMTA instructor for the certification program in Spanish. He has also earned his Six Sigma Green Belt from Dartmouth College's Thayer School of Engineering. Castellanos has worked for several major manufacturing companies, including Jabil Circuits in Guadalajara, Jalisco, Mexico. In addition, he has presented at numerous technical conferences and customer sites.
To register for Castellanos’ webinar, visit www.indium.com/webinar. The webinar link will be shared with registrants the day of the event. Registrants must use a company email account to avoid Indium Corporation’s spam filters. This is a first-come, first-served event.
Die Indium Corporation ist ein führender Materialveredler, -schmelzer, -hersteller und -lieferant für die weltweiten Elektronik-, Halbleiter-, Dünnschicht- und Wärmemanagementmärkte. Zu den Produkten gehören Lote und Flussmittel, Hartlote, Materialien für thermische Schnittstellen, Sputtertargets, Metalle und anorganische Verbindungen aus Indium, Gallium, Germanium und Zinn sowie NanoFoil®. Das 1934 gegründete Unternehmen verfügt über einen weltweiten technischen Support und Fabriken in China, Indien, Malaysia, Singapur, Südkorea, dem Vereinigten Königreich und den USA.
Weitere Informationen über Indium Corporation finden Sie unter www.indium.com oder per E-Mail an [email protected]. Sie können auch unseren Experten, From One Engineer To Another® (#FOETA), unter www.facebook.com/indium oder @IndiumCorp folgen.
