CLINTON, N.Y., July 2, 2026 — Indium Corporation® Senior Applications Development Engineer, Engineered Solder Materials (ESM), Ryan Mayberry will present research on the use of thermal interface materials (TIMs) to address next-generation AI and high-performance computing (HPC) thermal challenges at IMAPS ThermCon 2026, July 6-8, in Santa Clara, California.
The presentation, Addressing the Challenges of Metal Thermal Interface Materials in Large Area, High Thermal Design Power xPU Packages for AI, HPC, and Data Centers, examines the transition from traditional polymer-based materials to high-conductivity TIMs, addressing critical considerations, including thermal design power, package warpage, and compatibility within various system architectures. The session will provide insights into selecting optimal TIMs solutions to improve cooling efficiency and semiconductor package reliability. Implementing a high-bulk-thermal-conductivity, low-interfacial-resistance metal TIM reduces overall thermal resistance, provided these challenges are addressed.
Ryan Mayberry generates test strategies, data sets, and application guidelines for the ESM product line. He collaborates across internal functions to develop process recommendations and support new product qualifications in the growing power electronics and thermal management market segments.
Kyle Aserian, Indium Corporation Applications Development Engineer, ESM, co-authored the presentation.
IMAPS ThermCon attendees can attend Mayberry’s presentation on July 8 at 1:30-1:55 p.m. PT. To learn more about Indium Corporation’s thermal interface materials, visit indium.com or meet with our experts at the IMAPS ThermCon booth.
Über Indium Corporation
Die IndiumCorporation® ist ein führender Veredler, Verhitzer, Hersteller und Lieferant von Materialien für die weltweiten Märkte der Elektronik, Halbleiter, Dünnschichttechnik und des Wärmemanagements. Zu den Produkten zählen Lote und Flussmittel, Hartlote, Wärmeleitmaterialien, Sputtertargets, Indium-, Gallium-, Germanium- und Zinnmetalle sowie anorganische Verbindungen undNanoFoil®. Das 1934 gegründete Unternehmen verfügt über einen weltweiten technischen Support und Produktionsstätten in China, Deutschland, Indien, Malaysia, Singapur, Südkorea, Großbritannien und den USA.
Weitere Informationen über Indium Corporation finden Sie unter www.indium.com oder per E-Mail unter [email protected]. Sie können auch unseren Experten unter From One Engineer ToAnother® (#FOETA) unter www.linkedin.com/company/indium-corporation/ folgen.
