Indium Corporation will feature its precision gold alloy solder preforms at SPIE Defense + Commercial Sensing Expo, April 9-13, in Anaheim, Calif.
Depending on the alloy, gold-based solders have a melting point ranging from 280°C to 1064°C, making it compatible with subsequent reflow processes. In addition, gold-based solders are resistant to corrosion, provide superior thermal fatigue resistance, and exhibit excellent joint strength.
Indium Corporation’s AuSn preforms have the highest tensile strength of any solder, ensuring high-reliability for joining and sealing. AuSn preforms are designed for high-reliability applications, such as aerospace, defense, and medical.
Semiconductor-grade preforms are designed to meet the challenges faced as RF and power semiconductor devices continue to get smaller, with power density increasing both as a consequence of the shrink and as a result of increased power ratings.
Indium Corporation’s Pb-free and RoHS-compliant preforms are available in a variety of standard and custom-engineered designs. For more information about Indium Corporation’s gold alloy solder preforms, visit booth 121.
Weitere Informationen über die Indium Corporation finden Sie unterindiumstg.wpenginepowered.comoder per E-Mailan [email protected]. Sie können unseren Experten von „From One Engineer ToAnother®“(#FOETA) auch unterwww.facebook.com/indiumoder@IndiumCorp folgen.
