Indium Corporation’s Dr. Ning-Cheng Lee, vice president of technology, will present at the regional SMTA expos in Plano and Stafford, Texas.
On March 4, Dr. Lee will present Lead-free Solder Alloys – Pros and Cons and Novel High Temperature Option BiAgX at SMTA Dallas in Plano, Texas. This presentation covers the pros and cons of lead-free soldering, including process and reliability. Dr. Lee will also discuss a novel high temperature lead-free solder system called BiAgX®.
On March 6, Dr. Lee will present Voiding Control and Reliability of Solder Joints with Backward Compatibility at SMTA Houston in Stafford, Texas. His presentation discusses the voiding performance of backward compatible systems in terms of reflow profiles, alloy combinations, and reliability when compared to tin-lead and lead-free systems.
For more information about these two presentations or the SMTA expos, visit www.smta.org/expos.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests include advance materials for interconnects and packaging for electronics and optoelectronics applications, with an emphasis on both high performance and low cost of ownership.
Die Indium Corporation ist ein führender Materialhersteller und -lieferant für die weltweiten Elektronik-, Halbleiter-, Solar-, Dünnschicht- und Wärmemanagementmärkte. Zu den Produkten gehören Lote und Flussmittel, Hartlote, Materialien für thermische Schnittstellen, Sputtertargets, Metalle und anorganische Verbindungen aus Indium, Gallium, Germanium und Zinn sowie NanoFoil®. Indium wurde 1934 gegründet und verfügt über einen weltweiten technischen Support und Fabriken in China, Singapur, Südkorea, Großbritannien und den USA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
