Pressemitteilungen

As an advanced materials innovator and a premier global supplier to the mobile device assembly market, Indium Corporation is proud to be included in the Smithsonian National Museum of

Indium Corporation has earned the IEEE Malaysia Section Outstanding Industry Award (Innovation) for its InFORMSbrand of reinforced solder preforms. The award was presented during

As a proud Gold Sponsor of IPC’s Integrated Electronics Manufacturing & Interconnections (IEMI) 2023, advanced materials innovator Indium Corporation is pleased to exhibit

The upcoming SMTA China East Technical Conference will feature presentations by four Indium Corporation experts. The conference, which takes place July 19-20, is being held

Indium Corporation‘s Evan Griffith, Product Specialist for Semiconductor and Advanced Assembly Materials, will host two webinars about the increasing complexity of LED device assembly as

As an industry leader in innovative materials solutions for heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications, Indium Corporation will feature

Indium Corporation is honored to kick off its award-winning summer internship program with 13 new college students in the company’s 2023 class. The goal of Indium

Indium Corporation Strategic Advisor Dr. Dongkai Shangguan was honored by the IEEE Electronics Packaging Society (EPS) with its 2023 Electronics Manufacturing Technology Award at the

Indium Corporation Strategic Advisor Dr. Dongkai Shangguan is scheduled to deliver a keynote presentation at NordPac, hosted by IMAPS, June 12-14, in Oslo, Norway.  The

Indium Corporation Regional Technical Manager and Technologist Advanced Applications Andreas Karch is set to deliver a presentation at EPP InnovationsFORUM on June 29 in

Indium Corporation is proud to sponsor the four-part e-Mobility Electronics Hardware Reliability Webinar Series,hosted by IPC and moderated by Brian O’Leary, the

Indium Corporation senior research chemist Mary Ma is set to deliver a technical presentation titled Printable Copper Sintering Paste for High-Power Die-Attach

Indium Corporation senior technologist Dr. Ronald Lasky has been tapped by SMTA to conduct a three-part workshop, titled Solving Real-Life Problems Using the Tools of

Indium Corporation is pleased to announce that Jenny Gallery has been promoted to Senior Product Specialist.    In her new role, Gallery drives and supports gold- and

Indium Corporation will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications, as well as 5G communications, at the International

Indium Corporation is proud to introduce Indium8.9HFRV, a flux vehicle developed from the industry-leading Indium8.9HF chemistry. It features exceptional low-voiding performance while

Indium Corporation R&D Manager, Alloy Group Dr. HongWen Zhang is scheduled to deliver a presentation at the 73rd Electronic Components and Technology Conference (ECTC),

Solder Chemistry, an Indium Corporation company, will feature its proven solder paste solutions as part of the prestigious Fraunhofer Future Packaging production line

Advanced materials innovator Indium Corporation is pleased to announce that the company has joined the India Electronics and Semiconductor Association (IESA).  Through its