Pressemitteilungen

May 24, 2023

Indium Corporation to Sponsor, Moderate IPC e-Mobility Webinar Series

Indium Corporation is proud to sponsor the four-part e-Mobility Electronics Hardware Reliability Webinar Series,hosted by IPC and moderated by Brian O’Leary, the

May 23, 2023

Indium Corporation Senior Research Chemist to Present at CSTIC

Indium Corporation senior research chemist Mary Ma is set to deliver a technical presentation titled Printable Copper Sintering Paste for High-Power Die-Attach

May 18, 2023

Indium Corporations Dr. Ronald Lasky to Conduct Workshops on Lean Six Sigma for Electronics Assembly

Indium Corporation senior technologist Dr. Ronald Lasky has been tapped by SMTA to conduct a three-part workshop, titled Solving Real-Life Problems Using the Tools of

May 16, 2023

Jenny Gallery von Indium Corporations zum Senior Product Specialist befördert

Indium Corporation is pleased to announce that Jenny Gallery has been promoted to Senior Product Specialist.    In her new role, Gallery drives and supports gold- and

May 11, 2023

Indium Corporation präsentiert präzise Die-Attach-Vorformen auf Au-Basis auf dem internationalen Mikrowellensymposium

Indium Corporation will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications, as well as 5G communications, at the International

May 9, 2023

Indium Corporation stellt neue Pb-freie Lötpaste mit geringer Ausdehnung vor

Indium Corporation is proud to introduce Indium8.9HFRV, a flux vehicle developed from the industry-leading Indium8.9HF chemistry. It features exceptional low-voiding performance while

May 2, 2023

Indium Corporation Expert to Present on Low-Temperature Solder Paste at ECTC

Indium Corporation R&D Manager, Alloy Group Dr. HongWen Zhang is scheduled to deliver a presentation at the 73rd Electronic Components and Technology Conference (ECTC),

May 1, 2023

Solder Chemistry beteiligt sich an der Fraunhofer Future Packaging Produktionslinie auf der SMTconnect

Solder Chemistry, an Indium Corporation company, will feature its proven solder paste solutions as part of the prestigious Fraunhofer Future Packaging production line

April 27, 2023

Indium Corporation tritt dem indischen Elektronik- und Halbleiterverband bei

Advanced materials innovator Indium Corporation is pleased to announce that the company has joined the India Electronics and Semiconductor Association (IESA).  Through its

April 25, 2023

Indium Corporation präsentiert innovative Materialien für die Leistungselektronik auf der PCIM

As one of the leading materials providers to the power electronics assembly industry, Indium Corporation will proudly showcase a selection of innovative products at PCIM Europe, May

April 19, 2023

Indium Corporation veranstaltet Live-Webcast zu EV InSIDER mit Schwerpunkt auf Batterien

The next episode of Indium Corporations free webcast series EV InSIDER Live, titled e-Mobility Batteries: The Next Frontier of Sustainability and the Circular Economy, is set to

April 18, 2023

Experten der Indium Corporation präsentieren auf der PCIM Europe über Leistungselektronik

As one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight and knowledge on a variety of

April 17, 2023

Indium Corporation erhält EM World's Innovation Award für neue halogenfreie, reinigungsfähige Lotpaste

Indium Corporation has earned Electronics Manufacturing (EM) World‘s Innovation Award for SiPaste C201HF, a halogen-free, cleanable solder paste specifically formulated to

April 13, 2023

Indium Corporation tritt dem Europäischen Zentrum für Leistungselektronik bei

Advanced materials innovator Indium Corporation is pleased to announce that the company has joined the European Center for Power Electronics (ECPE), the leading industrial and

April 12, 2023

Indium Corporation stellt neues Mitglied des Global Accounts Team vor

Indium Corporation is pleased to announce that Toms Paulos has joined the company as an Assistant Global Accounts Manager.  Paulos is responsible for assisting with the management

April 11, 2023

Indium Corporation kündigt neue hochzuverlässige Niedrigtemperaturlegierung an

Indium Corporation has released a new, bismuth-based low-temperature alloy developed for low-temperature reflow processes which require enhanced thermal cycling reliability. Indalloy303, also

April 4, 2023

Indium Corporations Jenny Gallery präsentiert sich auf der HiTEC

Indium Corporation‘s senior product specialist Jenny Gallery will deliver a presentation at the International Conference and Exhibition on High Temperature Electronics

April 3, 2023

Indium Corporation stellt auf der productronica China bewährte EV-Produkte und hochzuverlässige Legierungen vor

Indium Corporation is proud to showcase its innovative products and expertise for the rapidly evolving electric vehicle manufacturing and e-Mobility market, including cutting-edge