Pressemitteilungen

Indium Corporation will feature its fine-grade precision die-attach AuSn ribbon at NEPCON Japan, January 15-17 in Tokyo, Japan. AuLTRA™-fine die-attach AuSn ribbon is designed

Two Indium Corporation experts shared their industry expertise at the Minor Metals Trade Association (MMTA) China Minor Metals Conference, November 4-5, Hong Kong, China.

Indium Corporation, a premium materials manufacturer and supplier of electronics assembly materials, and Mycronic, a global leader in dispensing and jet printing equipment, have

Indium Corporation’s Claire Hotvedt, Product Development Specialist, will present at the SMTA Indiana Indesign Product Engineering and Development LCC Symposium,November 19,

Indium Corporation’s industry partners will feature its proven products live on the show floor during Productronica from November 12-15, in Munich, Germany as part of the

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at Productronica, November 12-15, Munich, Germany. Indium Corporation is redefining solder with

Indium Corporation will feature its new high-performance, high-reliability low-temperature alloy technology at Productronica, November 12-15, Munich, Germany. DurafuseTM LT is a novel,

Indium Corporation’s Kenneth Thum, Senior Technical Support Engineer, will present at IEEE EPTC Singapore 2019, December 4-6, in Singapore. The development of

Indium Corporation will continue to celebrate its 85th anniversary by featuring some of its industry-leading and newest alloys at Productronica, November 12-15, in Munich, Germany.

Indium Corporation has released TACFlux® 108HF, a new no-clean, halogen-free, high tack force flux for hand soldering and rework applications.   TACFlux® 108HF is

Indium Corporation will show customers how to Avoid the Void® with its void-reducing Indium8.9HF Solder Paste series at CEIA Xiamen on November 7 in Xiamen, China.

Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, shared her industry expertise at the International Lead and Zinc Study Group conference, October

Indium Corporation, Utica’s Technology Company®, is proud to announce an upcoming presentation by David Socha, Technology Assessment Manager, at the ASM International Mohawk

Indium Corporation will feature its new high-performance, high-reliability alloy technology at PCB Carolina on November 13 in Raleigh, North Carolina, USA. Durafuse™ LT is a

Indium Corporation expert Joe Bahou, Technical Sales Support Engineer, will share his knowledge at the SMTA San Diego Technical Expo, November 5, San Diego, Calif., USA. Voiding can

Indium Corporation expert Dr. Jie Geng, Research Metallurgist, will share his knowledge at the IPC Electronics Materials Forum, November 5-7, Minneapolis, Minn., USA. Dr. Geng will

Indium Corporation will feature its new combined flip-chip and ball-attach flux, designed to provide a simple solution to SiP and flip-chip BGA assembly, at IEEE EPTC Singapore 2019,

Indium Corporation expert Graham Wilson, Applications Engineer, will present at the Advanced Electronics Assembly Conference (AEAC) in two locations—first on November

Indium Corporation expert Dr. Ning-Cheng Lee, Vice President of Technology, will present at IMPACT-IAAC 2019, Oct. 23-25, Taipei, Taiwan. Dr. Lee will present Novel Fluxes with

Indium Corporation will feature its unique solid/liquid hybrid thermal interface materials—m2TIMTM—at the Semi-Therm Thermal Technologies Workshop, Nov. 4-6, Redmond, Wash.

Indium Corporation will feature an innovative alloy and solder paste with high-reliability and enhanced-performance capabilities at Productronica, Hall A4, Booth 214, November 12-15, in