Pressemitteilungen

Indium Corporation’s Technical Manager Karthik Vijay will present his technical findings at the European Microelectronics and Packaging Conference (EMPC), September 12-15, 2011, in Brighton,

Indium Corporation expert Dr. Ning-Cheng Lee will present his technical findings at the 12th International Conference on Electronic Packaging Technology & High Density Packaging

Indium Corporation announces the promotion of two individuals, both based at Indium’s headquarters in Clinton, NY. Jeff Anweiler has been promoted to the position of Eastern U.S. and Canada

Indium Corporation is featuring its newly developed SAC105+Mn at NEPCON South China (Shenzhen), August 30-September 1, 2011. SAC105+Mn is the industry’s first reliable, Pb-free, low-Ag alloy

Indium Corporation Senior Technical Support Engineer Eric Bastow will present his IPC APEX EXPO 2010 and 2011 technical papers as part of IPC’s Summer School webinar series on Wednesday, August

Indium Corporation’s Applications Engineer Amanda Hartnett will present her technical findings at IMAPS Mid-Atlantic Microelectronics Conference in Atlantic City, NJ, June 23-24,

Indium Corporation’s Senior Technical Support Engineer Chris Nash will present his technical findings at the Huntsville SMTA Expo and Tech Forum on June 22, in Huntsville, AL. Chris will

Indium Corporation Vice President of Technology Dr. Ning-Cheng Lee was recognized for Best Presentation of Technology Conference One at NEPCON China (Shanghai) 2011 by Surface Mount Technology

Indium Corporation Vice President of Technology Dr. Ning-Cheng Lee will teach a professional development course at the Electronic Components and Technology Conference (ECTC) in Lake Buena Vista,

Indium Corporation’s Area Technical Manager, Sehar Samiappan will present two technical papers at SMTA’s South East Asia Technical Conference on Electronics Assembly Technologies, Penang,

Indium Corporation’s Senior Technical Support Engineer Chris Nash will present his technical findings at SMTA’s Capital Chapter meeting on May 17, 2011, at Johns Hopkins

Two of Indium Corporation’s technology experts will present their technical findings at NEPCON China (Shanghai) in Shanghai, China, May 11-13, 2011. Aaron Yan, (严俊杰),

Indium Corporation’s Technical Support Engineer Ed Briggs,  will present his technical findings at SMTA Toronto Expo and Tech Forum, Toronto, Canada, May 5, 2011. Ed will present

Two of Indium Corporation’s technology experts will present their technical findings at IMAPS New England in Boxborough, MA, May 3, 2011.   Ronald C. Lasky, Ph.D., PE, Senior

Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will present two tutorials at SMT/Hybrid/Packaging exhibition and conference in Nuremberg, Germany, May 3-5,

Three of Indium Corporation’s technology experts will present technical findings at Society of Vacuum Coaters (SVC) Technical Conference in Chicago, IL, April 18-21, 2011. Malcolm Harrower,

Four of Indium Corporation’s technology experts will present their technical findings at APEX in Las Vegas, Nevada, April 10-14, 2011. Ning-Cheng Lee, Ph.D., Vice President of Technology

Indium Corporation announces that they have appointed AdoptSMT Europe GmbH as its newest sales channel partner in Austria. AdoptSMT is responsible for distributing Indium’s solder products,

Indium Corporation has expanded their blogging program to provide posts in seven languages. This provides more customers the opportunity to read Indium Corporation’s blogs in their preferred

Indium Corporation announces that Ron Hunadi, Ph.D., has been hired as the Market Development Manager for Semiconductor and Advanced Materials. He is based at his home offices in Mesquite, NV and

Indium Corporation’s Global Product Manager, Semiconductor and Advanced Assembly Materials, Dr. Andy Mackie, will be presenting at the Surface Mount Technology Association (SMTA) Intermountain