Applications Semiconductor Packaging & Assembly

Semiconductor Packaging and Assembly

As semiconductor packaging technologies evolve to meet industry demands of smaller, faster, higher power, more reliable, more efficient devices, packaging and assembly materials play a crucial role. From industry leading die attach solder pastes, ultra-fine solder pastes for SiP, to innovative flux technology for flip-chip bonding and BGA ball attach. Indium Corporation’s semiconductor packaging and assembly materials address todays challenges and help power the future.

Close-up of a colorful patterned microchip surface with a grid-like structure and a reflective sheen.
Two people in lab coats examine a circuit board in a laboratory setting.

Overview

Semiconductor packaging and assembly are critical to manufacturing semiconductor devices, ensuring functionality, efficiency, and reliability. This back-end-of-line (BEOL) process involves encapsulating the silicon die or integrated circuit (IC) to ensure reliable electrical connections to the PCB and other systems. It’s essential for maintaining functionality and durability in diverse environments. Indium Corporation’s expertise in these processes and product selection meets the unique needs of the industry.

Proven Materials

Leading the Way

SiPaste®3.2HF

Fluxless

20 Years

High-temperature Pb-free

5 Billion

Sustainability

These fluxes enable a true no-clean process, driving sustainability by reducing costs related to cleaning chemicals, water, and energy consumption.

Interconnect Reliability

Thermal Management

Material Compatability

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