Applications
Semiconductor Packaging and Assembly
As semiconductor packaging technologies evolve to meet industry demands of smaller, faster, higher power, more reliable, more efficient devices, packaging and assembly materials play a crucial role. From industry leading die attach solder pastes, ultra-fine solder pastes for SiP, to innovative flux technology for flip-chip bonding and BGA ball attach. Indium Corporation’s semiconductor packaging and assembly materials address todays challenges and help power the future.
Overview
Semiconductor packaging and assembly are critical to manufacturing semiconductor devices, ensuring functionality, efficiency, and reliability. This back-end-of-line (BEOL) process involves encapsulating the silicon die or integrated circuit (IC) to ensure reliable electrical connections to the PCB and other systems. It’s essential for maintaining functionality and durability in diverse environments. Indium Corporation’s expertise in these processes and product selection meets the unique needs of the industry.
Features & Benefits
Essential Considerations in Semiconductor Packaging & Assembly
Semiconductor assembly involves the process of packaging and interconnecting semiconductor chips or integrated circuits onto a substrate to create functional electronic devices. Semiconductor packaging involves these key considerations:
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