When the firsthigh-volume, automated, die-bonding machines for laser diode assembly were created, a single supplier dominated the market, providing all the solder materialneeded for this application. Generally used for manufacturing optical diode components in wireless communication and automotive applications, these die-bonding machines required a specific type of solder: 80Au20Sn ribbon < 0.1” wide. Furthermore, the ribbon needed to be packaged in longcontinuous lengths suitable for high volume manufacturing. When companies using this new technology began to branch out in search ofnew suppliers, Indium Corporation saw an opportunity to develop a superior product and enter this exciting regional market.
Para estos sistemas de alimentación automática, la precisión y la calidad de la cinta y de la bobina son de suma importancia, junto con longitudes largas y continuas. Estas características ayudan a minimizar el tiempo de inactividad de la producción y facilitan un proceso eficiente y de alto rendimiento que da como resultado un producto final de alta calidad y un bajo coste de propiedad.
With investment and process improvement, Indium Corporation developed our AuLTRA™ Fine Ribbon! This is < 0.1” wide fine-grade, precision ribbon for high volume, fully automated laser diode assembly processes down to 0.010” width and 0.0006” thick capabilities. Our high quality, precision AuLTRA™ Fine Ribbon is designed for high volume production and is packaged on precision spools suitable for auto-feed systems. AuLTRA™ Fine Ribbon is available now in a broad range of sizes, with 15+ meters length per spool capabilities.
Si tiene alguna pregunta o desea más información sobre nuestra cinta fina AuLTRA™, póngase en contacto conmigo en [email protected].
