CLINTON, N.Y., July 30, 2026 — As a leading provider of high-reliability soldering and sintering materials for power electronics devices, Indium Corporation experts will share new research and insights on these two core industry product solutions at the International Conference on Electronics Packaging Technology (ICEPT) 2026, August 5-7, in Xi’an, China.
August 6, 13:00-13:25 CST – A Review of a Bi-Free In-Containing Lead-Free Mid-Temperature Solder, presented by Hongwen Zhang, Ph.D., Research and Development Director and Principal Metallurgist.
By eliminating brittle bismuth-rich phases, Indium Corporation’s Durafuse® LT solder delivers at least two orders of magnitude improvement in drop shock resistance and significantly reduced electromigration rates—performance comparable to or exceeding SAC305. The session will also show how Durafuse® LT’s lower reflow temperatures reduce warpage-related defects in large-format BGA packages, establishing it as a high-reliability platform for next-generation electronics assembly.
August 6, time TBD – Pressure Cu Sintering Paste Developed for Next-Generation Interconnection Material, presented by Mary Li Ma, Senior Research Chemist.
This presentation introduces a next-generation copper sintering paste developed for high-power semiconductor applications. It will demonstrate how the material delivers high reliability, excellent thermal and electrical performance, and strong bonding without requiring gold or silver plating. The session also explores advances in oxidation resistance, extending shelf life, and processing flexibility that make this novel paste a promising die-attach solution for power electronics.
About the Presenters
Hongwen Zhang leads technology development, product road mapping, and the continued advancement of the Indium Corporation materials portfolio. For nearly two decades he has played a key role in advancing high-temperature, lead-free solder materials and strengthening the company’s metallurgical expertise. Zhang is co-inventor of Indium Corporation’s Durafuse® technology, led development of the BiAgX® alloy family—the first non-gold-based high-temperature lead-free solders—and has contributed to numerous customer collaborations and technical partnerships.
Mary Ma joined Indium Corporation in 2010 and has more than 10 years of experience in the development of advanced materials that are applied in the semiconductor and electronics assembly industry. She is responsible for product development for copper sintering materials for use in advanced die-attach semiconductor technology. Ma has also led the development of ultra-low-voiding solder paste and launched an advanced solder paste solution widely applied in the electronics assembly field.
To learn more about Indium Corporation’s patented Durafuse® technology and its sintering materials portfolio, visit indium.com.
Acerca de Indium Corporation
IndiumCorporation® es una empresa líder en el refinado, la fundición, la fabricación y el suministro de materiales para los mercados mundiales de la electrónica, los semiconductores, las películas finas y la gestión térmica. Entre sus productos se incluyen soldaduras y fundentes; soldaduras fuertes; materiales de interfaz térmica; blancos de pulverización catódica; metales y compuestos inorgánicos de indio, galio, germanio y estaño; yNanoFoil®. Fundada en 1934, la empresa cuenta con asistencia técnica a nivel mundial y fábricas situadas en China, Alemania, India, Malasia, Singapur, Corea del Sur, el Reino Unido y Estados Unidos.
Para obtener más información sobre Indium Corporation, visite www.indium.com o envíe un correo electrónico a [email protected]. También puede seguir a nuestros expertos, From One Engineer ToAnother® (#FOETA), en www.linkedin.com/company/indium-corporation/.
