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Indium Corporation has expanded its portfolio of proven pastes with a new no-clean, halogen-free solder paste designed for advanced LED applications, including COB, COG, SMT, and other LED

Indium Corporation has earned a BISinfotech BETA Award as Global Leader in Solder and Materials category. The honor was presented during a live streaming of the awards

The next episode of Indium Corporation‘s free webcast series, EV InSIDER Live, will examine the ups and downs that marked the electric vehicle (EV) and EV charging industry this year.

Indium Corporation will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications at SPIE Photonics West, Jan. 28-Feb. 3, San

Indium Corporation is pleased to announce the promotion of Claire Hotvedt to the role of Senior Product Development Specialist. As the Senior Product Development Specialist, Hotvedt

Indium Corporation product specialist and former talent acquisition supervisor, Jim McCoy, was recognized by Oneida-Herkimer-Madison (OHM) BOCES with their 2022 Individual

Indium Corporation has announced a new jetting solder paste in its line of PicoShot products. PicoShot WS-5M is designed for customers needing an SnPb solder paste for

Indium Corporation is pleased to announce that Theo Ruas has been promoted to the role of Global Sales Manager, Metals and Compounds.  In his new role, Ruas leads all aspects of

Indium Corporation‘s former board chairman William (Bill) N. Macartney III was posthumously honored with the Christopher Destito Award by Mohawk Valley EDGE as part of their

Indium Corporation‘s David Socha, technology assessment manager, will present on Indium Corporation’s innovative 3D-EZ-Release build plate, a cutting-edge technology that allows for

Indium Corporations expertise and proven products were featured at NSW Automations launch of its N4 Full-Range Solder Paste Micro-Dispenser during a special event in Penang, Malaysia. 

Indium Corporation has earned a GLOBAL Technology Award from Global SMT & Packaging for its fast wetting, no-clean cored wire with spatter control, CW-818. The

Indium Corporation is pleased to announce the promotion of Sze Pei Lim to the role of Senior Global Product Manager, Semiconductor and Advanced Materials. Lim leads all aspects of the

The upcoming Electronics Packaging Technology Conference (EPTC) will feature presentations by two Indium Corporation experts. The conference, which takes place December 79 in

Indium Corporation will be showcasing its innovative products and technology throughout the China market at five industry tradeshows in October and November. The award-winning materials

The next episode of Indium Corporations free webcast series, EV InSIDER Live, will examine the sudden proliferation of electric vehicle startups chasing one of the largest business opportunities

Indium Corporations Strategic Advisor Dr. Dongkai Shangguan will deliver a keynote presentation on interconnect reliability at the IEEE Symposium on Reliability for Electronics and

Indium Corporation Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim, will be part of a panel presentation at the International Microsystems,

Indium Corporation, a global electronics materials manufacturer and SAFI-Tech, an Iowa-based startup that is creating no-heat and low-heat solder and metallic joining products, have announced