Bibliothèque
Communiqués de presse
Sujet
Type
Année
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Indium Corporation Expert to Present on Gold Solder Solutions for Medical Applications at IMAPS 2025 Workshop
Indium Corporation®’s Senior Product Specialist Jason Farrell will deliver a technical presentation at the IMAPS Advanced Packaging for Medical Microelectronics Workshop, taking place March
Indium Corporation Expert to Address Thermal Challenges at TestConX 2025
Indium Corporation Technical Support Engineer Carson Burt will deliver a technical presentation at TestConX 2025, taking place March 3-5 in Mesa, Arizona. The presentation, Solving Warping Issues
Indium Corporation présentera à SPIE Photonics West des préformes d'attachement de précision à base d'Au
Indium Corporation® will feature its high-reliability, Au-based precision die-attach preforms for critical laser and RF applications at SPIE Photonics West, Jan. 28-30, in San Francisco, California.
Indium Corporation to Showcase Durafuse® Solder Technology at NEPCON Japan
As one of the leading materials providers in the electronics assembly industry, Indium Corporation® is looking forward to featuring its innovative Durafuse® solder technology at NEPCON Japan,
Indium Corporation Experts to Present at Pan Pac 2025
Indium Corporation Senior Technologist Dr. Ronald Lasky and Senior Product Development Specialist Kevin Brennan will deliver a series of presentations at the Pan Pacific Strategic Electronics
Indium Corporation Expert to Present on Solder Solutions for AI and Automotive Applications at NEPCON Japan 2025
Indium Corporation Senior Area Technical Manager Jason Chou will deliver a technical presentation at NEPCON Japan, on January 22-24, in Tokyo, Japan. The presentation, High Reliability and
Indium Corporation to Showcase Power Electronics Products at NEPCON Japan
As one of the leading materials providers in the electronics assembly industry, Indium Corporation® is proud to feature its lineup of high-reliability products for power electronics at NEPCON Japan,
Indium Corporation to Showcase Precision Gold Solder Solutions at MD&M West 2025
Indium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MD&M West, taking place February 4-6 in Anaheim, California. AuLTRA® MediPro is a family of
Indium Corporation Introduces New ROL0 and Halogen-free Flux-cored Wire
Indium Corporation today announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics
Indium Corporation Announces Executive Leadership Appointments
Evans appointed executive chair of board of directors, Berntson named CEO Indium Corporation®, a leading materials refiner, smelter, manufacturer, and supplier to global electronics,
Indium Corporation Honored by Electronics Era with Excellence in Electronics Assembly Materials Award
Indium Corporation is proud to announce its recent achievement of the Excellence in Electronics Assembly Materials Award from Electronics Era, as part of the EE Excellence & Achievers Awards
Indium Corporation Technical Expert to Present at SiP Conference China
Indium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China
Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024
Indium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA®
Indium Corporation reçoit le Global Technology Award à SMTA International
Indium Corporation a été récompensée par un Global Technology Award lors d'une cérémonie de remise des prix le 22 octobre 2024 à SMTA International à Rosemont, Illinois. L'entreprise a reçu le
Indium Corporation reçoit le prix du partenariat entreprise/industrie décerné par le NYCCT
Indium Corporation is honored to announce that it has been awarded the Edward J. Pawenski Business/Industry Partnership Award by the New York Community College Trustees (NYCCT). The award was
Indium Corporation Announces InnoJoin as Exclusive Global Sales Partner for NanoFoil®
Indium Corporation today announced that InnoJoin GmbH will be the exclusive global sales partner for NanoFoil® in component mounting applications. NanoFoil® is a leading nanotechnology material
Des experts d'Indium Corporation feront une présentation à SMTA International
En tant que l'un des principaux fournisseurs de matériaux pour l'industrie de l'assemblage de l'électronique de puissance, les experts d'Indium Corporation partageront leur vision technique et leurs connaissances sur une variété de sujets liés à l'industrie.
Indium Corporation présente ses produits de brasage et sa nouvelle formule de fil fourré au salon SMTA International
En tant que l'un des principaux fournisseurs de matériaux dans l'industrie de l'assemblage électronique, Indium Corporation est fière de présenter ses produits innovants et ses présentations techniques au salon SMTA International.
Des experts d'Indium Corporation participeront à la conférence internationale sur les technologies de fabrication des produits électroniques
Indium Corporation est fière d'annoncer sa participation à la prochaine conférence internationale sur les technologies de fabrication électronique (IEMT), qui se tiendra du 16 au 18 octobre à Penang, en Malaisie. Cinq
Indium Corporation présentera sa technologie de pointe en matière de pâtes à braser et d'alliages au Detroit Battery Show
Indium Corporation, l'un des principaux fournisseurs de matériaux pour l'industrie de l'assemblage électronique, est fier de présenter sa technologie de soudure Durafuse à la pointe de l'industrie au Battery Show North
Indium Corporation présentera des produits d'assemblage électronique innovants lors du Symposium international sur la microélectronique
As one of the leading materials providers to the electronics assembly industry, Indium Corporation is proud to feature its innovative products at the International Symposium on Microelectronics,













