Comunicados de prensa

Indium Corporation has honored nine of its employees for their technical industry contributions with its annual Silver Quill Award. While the companys thought leaders present technical content at

Indium Corporation is proud to introduce new, high-reliability Au-based Precision Die-Attach (PDA) Preforms. Compared to standard preforms, these gold-based PDA preforms offer a higher level of

Indium Corporation is pleased to introduce a new jetting solder paste to join its PicoShot series of products. PicoShot NC-6M is a no-clean, halogen-free, Type 6 powder-size material specifically

Indium Corporation Technical Manager for Europe, Africa, and the Middle East Karthik Vijay will present a technical presentation at the International Conference and Exhibition on

Indium Corporation is proud to introduce Durafuse HR, a new high-reliability alloy used for solder paste, developed from the companys Durafuse mixed-alloy technology. Durafuse HR is a patent-pending

Indium Corporation is pleased to welcome 13 new interns into its award-winning summer internship program. Indium Corporations internship program is a launch pad for talented college

Indium Corporation, a leading innovator in industrial material solutions, is thrilled to announce the appointment of Werner H. J. Wagner as its new General

Indium Corporation will feature its high-reliability, gold-based precision die-attach (PDA) preforms for critical laser and RF applications, as well as 5G communications, at the International

Sze Pei Lim, director mundial de productos semiconductores y materiales avanzados de Indium Corporations, realizará dos presentaciones técnicas en la 11ª edición de Micro/Nano-Electronics Packaging and

Solder Chemistry, a trusted brand for over 30 years now powered by Indium Corporation, will feature its complete suite of services for PCBA as part of the prestigious Fraunhofer Future Packaging

As one of the leading materials providers to the power electronics assembly industry, Indium Corporation will proudly showcase a selection of innovative products at PCIM Europe, June 11-13, in

Indium Corporation Research Associate Kyle Aserian will deliver a presentation at the 74th Electronic Components and Technology Conference (ECTC) on May 31, in Denver,

Indium Corporation Technical Support Engineer, CSMPTE, Thuy Nguyen will present at the SMTA Rocky Mountain Expo on May 16 in Aurora, Colorado. The presentation, Exploring Alternative Solder Alloys

Como uno de los principales proveedores de materiales para la industria de ensamblaje de electrónica de potencia, los expertos de Indium Corporation compartirán sus conocimientos técnicos sobre una variedad de temas relacionados con la industria.

Indium Corporation Technical Manager for Europe, Africa, and the Middle East, Karthik Vijay, will deliver a technical presentation and Indium Corporation Senior Technologist, Dr. Ronald Lasky, will

As an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation will feature its advanced products designed to meet the evolving challenges of

Dean Payne, director de productos semiconductores de Indium Corporation, participará en la conferencia Advanced Packaging for Power Electronics, organizada por IMAPS y que se celebrará los días 8 y 9 de mayo en Woburn, Massachusetts (EE.UU.).

Indium Corporation has earned the CIRCUITS ASSEMBLY New Product Introduction (NPI) Award for its low-voiding, Pb-free solder paste, Indium8.9HFRV. The award was presented at the IPC APEX Expo in

Indium Corporations Senior Research Metallurgist, Jie Geng, Ph.D., will conduct a webinar on low-voiding, high-reliability, lead-free solder paste for automotive applications. The webinar, part of

Sze Pei Lim, Director General de Productos de Semiconductores y Materiales Avanzados de Indium Corporation, participará en la Conferencia Internacional sobre Electrónica (International Conference on Electronics).

Indium Corporation is set to present and exhibit at EPP InnovationsFORUM, one of Europe’s premier single-day electronics manufacturing forums, on April 17 in