fluxes
Semiconductor Fluxes
Indium Corporation is a leading innovator in semiconductor fluxes, offering a comprehensive range of proven and advanced solutions critical for forming reliable solder joints in semiconductor packaging. Our materials spearhead the production of durable, high-performance products designed to withstand physical shocks and thermal stresses common in electronic devices. From Internet of Things (IoT) and mobile devices to low-energy servers and automotive electronics, our fluxes help ensure strength and reliability across a wide range of applications.
Powered by Indium Corporation
- Leader in ultra-low-residue, no-clean flux
- Easy-to-clean water-wash formulas
- Strong technical expertise
Product Overview
The primary role of flux is to remove oxides and impurities from soldering surfaces, enabling proper wetting of the solder and ensuring strong, reliable connections that maintain the integrity and functionality of semiconductor packages. Our diverse portfolio includes both flux and flux-less solutions, offering water-wash and no-clean options to meet the needs of various applications, from ball-attach to flip-chip and more.
Semiconductor Flux Products
Wafer Bumping Flux
High-quality wafer bumping fluxes for efficient removal of
Flip-Chip Flux
Offers advanced fluxes for flip chip assembly, water-soluble &
Ball-Attach Flux
High-quality water-wash and no-clean ball-attach
Features
Proven
Wafer bumping flux WS-3401 and flip-chip flux WS-641 are widely applied in 2.5D and advanced semiconductor assembly.
Pioneering Excellence
As developers of the first ultra-low residue flux, we have remained at the forefront of innovation with a wide range of advanced ultra-low residue solutions. These fluxes enable a true no-clean process, promoting sustainability by eliminating the need for cleaning chemicals and significantly reducing water and energy consumption, all while lowering operational costs.
One-Step
Water-washable ball-attach and flip-chip flux WS-446HF has demonstrated outstanding performance on Cu-OSP, streamlining the process by eliminating extra cleaning steps that typically involve additional flux to remove excessive oxides. A one-step Cu-OSP process enhances efficiency.
Related Applications
Semiconductor Fluxes are available to use in a wide range of applications.
PCB Assembly
Proven and cutting-edge materials for PCB assembly
Semiconductor Packaging & Assembly
Critical semiconductor packaging ensures functionality and
Power Electronics Packaging & Assembly
Extensive range of proven high-reliability solder and more
Related Markets
Our materials contribute to the production of robust, reliable products that can endure the physical impacts and thermal stresses typical of electronic devices. Whether it’s for IoT mobile devices, high-performance computing, or automotive electronics, our solutions ensure durability across a range of demanding applications.
Expert Support for Reliable Results
Do you have technical questions or sales inquiries? Our dedicated team is here to help. “From One Engineer to Another®” isn’t just our motto—it’s our commitment to delivering exceptional service. We’re ready when you are. Let’s connect!
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