Products
Sintering Materials
Sintering is a technique that bonds pure metal particles with an organic binder through the application of heat. This process causes the metal particles to fuse both with each other and with the surfaces they contact. There are two primary sintering methods: pressured and pressureless. In electronics assembly, silver (Ag) and copper (Cu) are frequently utilized, with copper emerging as a key material and technology. Indium Corporation offers silver and copper sinter pastes with exceptional thermal and electrical conductivity, enabling device operation at temperatures exceeding 175°C and providing superior reliability compared to solder.
Powered by Indium Corporation
- Pressure and Pressureless Formulations
- Pure Sinter Materials (No Epoxy or Polymer)
- High Metal, Low Organic Approach
Sintering Products
Indium Corporation provides a range of sinter pastes tailored for various applications. The InFORCE® series is optimized for pressure sintering, while the InBAKE™ series is ideal for traditional pressureless sintering. For fast, small-area sintering, the QuickSinter® series delivers exceptional performance, ensuring rapid and efficient results.
InFORCE®
InFORCE Series sinter pastes excel in high-performance
InBAKE™
Pressure-less sinter pastes for traditional batch oven
QuickSINTER®
Minimize sintering time on small dies to under 20
Product Data Sheets
Related Applications
Power Electronics Packaging & Assembly
Extensive range of proven high-reliability solder and more
Die-Attach
Die-attach solutions include solder pastes to gold-based
Package-Attach
Wide selections to address the challenges in
Related Markets
Sintering techniques and materials are widely used in the power electronics industry for packaging and assembly, as well as in markets like automotive and e-mobility.
Expert Support for Reliable Results
Do you have technical questions or sales inquiries? Our dedicated team is here to help. “From One Engineer to Another®” isn’t just our motto—it’s our commitment to delivering exceptional service. We’re ready when you are. Let’s connect!
Development of Innovative Advanced Packaging Materials for System in Package
Advanced packaging has continued to evolve with various interconnect technologies on their way towards heterogeneous
Interconnect Reliability: From the Chip to the System
Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle from the chip to the system—from IC design, wafer fab,
Sinter material for power electronics – copper’s time to shine?
In recent years, silver sinter materials have grown in popularity in power module assembly, especially for die attach. When compared to traditional solders, silver sinter offers numerous benefits
Why QuickSinter®? Let’s see the difference between Soldering and Sintering
One of the most unique features of any sintering material, including our QuickSinter® material, is that it does not need to reach or remain above a liquidus temperature like traditional solder.
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