The International Microwave Symposium (IMS) (June 21-23) is the premier annual international meeting for technologists involved in all aspects of microwave theory and practice. It consists of a full week of events, including technical paper presentations, workshops, and tutorials, as well as numerous social events and networking opportunities.
Indium Corporation's new off-eutectic alloy preforms ensure strong solder joints in a plethora of device and package hardware. Our off-eutectic AuSn preforms are currently available now in 79/21, 78/22, and 75/25 compositions, with a wide range of X, Y, and Z dimensions available.
The International Microwave Symposium (IMS) Live Stream Event (Aug 4-6) is the premier annual international meeting for technologists involved in all aspects of microwave theory and practice. It consists of a full week of events, including technical paper presentations, workshops, and tutorials, as well as numerous social events and networking opportunities.
The joint may be of polymer (adhesive), metal-filled polymer, or in the form of solder derived from a preform or solder paste. (Die-attach wire may also be available.)
Although there are four major processes for die-attach, solder-based processes are still the most popular, as they provide high reliability with ease of processing. Indium Corporation’s die-attach solder paste is typically a dispensable, high melting-point solder paste, which is reflowed in forming gas (H2N2 mix).
Key Performance Needs
Low voiding in reflow
Long dispense life
Residue-free cleaning or residue compatible with overmolding process
“Power-Safe” NC-SMQ®75 Die-Attach Solder Paste
NC-SMQ®75 is the only solder paste suitable for use in non-cleaned clip-bonded applications in power semiconductor die-attach assemblies. It has:
Superior wetting capabilities compared to most low residue formulations
Indium Corporation’s “Power-Safe” NC-SMQ75 is an ultra-low residue, halogen-free, die-attach solder paste that leaves a completely benign, almost undetectable residue of approximately 0.4 weight percent of paste.
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