Die-Attach

Die-Attach

Die-attach is the term reserved for processes where the face of a die is attached to a substrate by a single joint.

Features & Benefits

The joint may be of polymer (adhesive), metal-filled polymer, or in the form of solder derived from a preform, solder paste, or solder wire.
Die-Attach Wire

Die-Attach Wire

Indium Corporation's Die-Attach Wire (or SSDA [soft solder die-attach] wire) is a fluxless solder wire used to effect die-attach. SSDA grade wire will result in higher yields of an improved quality product with fewer interruptions in production.

Key Performance Needs
  • Ultralow oxide (wire surface and in wire)
  • High alloy purity
  • Precise and consistent wire diameter
  • Tight alloy chemistry control
Die-Attach Wire Diagram
Die-Attach Paste

Die-Attach Paste

Although there are four major processes for die-attach, solder-based processes are still the most popular, as they provide high reliability with ease of processing. Indium Corporation’s die-attach solder paste is typically a dispensable, high melting-point solder paste, which is reflowed in forming gas (H2N2 mix).

Key Performance Needs
  • Low voiding in reflow
  • Long dispense life
  • No tailing
  • No separation
  • Bubble-free packaging
  • Residue-free cleaning or residue compatible with overmolding process
Die-Attach Paste Diagram
“Power-Safe” NC-SMQ®75 Die-Attach Solder Paste

NC-SMQ®75 is the only solder paste suitable for use in non-cleaned clip-bonded applications in power semiconductor die-attach assemblies. It has:

  • Superior wetting capabilities compared to most low residue formulations
  • Trouble-free probe testing
  • No-residue appearance
BiAgX®75 Solder Paste

BiAgX®75 is a high-melting, lead-free solder paste technology that serves as a drop-in replacement for the high-Pb solder pastes used in many high-reliability, die-attach, and electronics assembly applications.

“Power-Safe” NC-SMQ75 Die-Attach Solder Paste

Indium Corporation’s “Power-Safe” NC-SMQ75 is an ultra-low residue, halogen-free, die-attach solder paste that leaves a completely benign, almost undetectable residue of approximately 0.4 weight percent of paste.

Product specs

NC-SMQ75 is the only solder paste suitable for use in non-cleaned clip bonded applications in power semiconductor die-attach assemblies.

It is designed for reflow in a nitrogen or forming gas atmosphere of 100 ppm oxygen or less and can survive the high temperatures associated with both high-lead (Pb) and gold-tin alloy reflow.

Bellcore and J-STD tests and results chart
Features:
  • Ultra-low post-reflow residue <0.5%w/w of solder paste
  • “Power-Safe” residue compatible with overmolding compounds without delamination
  • Halogen-free
  • Consistent dispensing deposit size without clogging (Powder types 3, 4, 5, 6)
  • Airlessly syringe-packed (bubble-free)
  • Wide range of alloy compatibility
  • Reflow up to 400°C
    • Low oxygen or forming gas needed (<100ppmO2)
  • Low-voiding for smaller die (< 6mm x 6mm)
    • Meets <5% single, <10% total industry voiding standard
  • Good wetting with common metal finishes
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