Indium Corporation's new off-eutectic alloy preforms ensure strong solder joints in a plethora of device and package hardware. Our off-eutectic AuSn preforms are currently available now in 79/21, 78/22, and 75/25 compositions, with a wide range of X, Y, and Z dimensions available.
The International Microwave Symposium (IMS) Live Stream Event (Aug 4-6) is the premier annual international meeting for technologists involved in all aspects of microwave theory and practice. It consists of a full week of events, including technical paper presentations, workshops, and tutorials, as well as numerous social events and networking opportunities.
Indium Corporation has developed 80Au20Sn < 0.1” wide fine-grade precision ribbon for high volume, fully automated laser diode assembly processes. Our high quality precision AuLTRA™ Fine Ribbonis designed for high volume production and is packaged on precision spools suitable for auto-feed systems.
Indium Corporation has developed a thinner gold preform for high-output lasers, therefore improving the thermal transfer and operational efficiency of high-output lasers by reducing voiding, solder volume, and wicking up the die.
Dr. McDonough discusses some of the benefits of QuickSinter® including its ability to handle high-temperature operating life without breaking down and its ability to maintain a uniform bondline. Read this post to learn more.
The joint may be of polymer (adhesive), metal-filled polymer, or in the form of solder derived from a preform, solder paste, or solder wire.
Die-Attach Wire
Indium Corporation's Die-Attach Wire (or SSDA [soft solder die-attach] wire) is a fluxless solder wire used to effect die-attach. SSDA grade wire will result in higher yields of an improved quality product with fewer interruptions in production.
Although there are four major processes for die-attach, solder-based processes are still the most popular, as they provide high reliability with ease of processing. Indium Corporation’s die-attach solder paste is typically a dispensable, high melting-point solder paste, which is reflowed in forming gas (H2N2 mix).
Key Performance Needs
Low voiding in reflow
Long dispense life
No tailing
No separation
Bubble-free packaging
Residue-free cleaning or residue compatible with overmolding process
“Power-Safe” NC-SMQ®75 Die-Attach Solder Paste
NC-SMQ®75 is the only solder paste suitable for use in non-cleaned clip-bonded applications in power semiconductor die-attach assemblies. It has:
Superior wetting capabilities compared to most low residue formulations
Trouble-free probe testing
No-residue appearance
BiAgX®75 Solder Paste
BiAgX®75 is a high-melting, lead-free solder paste technology that serves as a drop-in replacement for the high-Pb solder pastes used in many high-reliability, die-attach, and electronics assembly applications.
Indium Corporation’s “Power-Safe” NC-SMQ75 is an ultra-low residue, halogen-free, die-attach solder paste that leaves a completely benign, almost undetectable residue of approximately 0.4 weight percent of paste.
Please scroll right to view all available information.
NC-SMQ75 is the only solder paste suitable for use in non-cleaned clip bonded applications in power semiconductor die-attach assemblies.
It is designed for reflow in a nitrogen or forming gas atmosphere of 100 ppm oxygen or less and can survive the high temperatures associated with both high-lead (Pb) and gold-tin alloy reflow.
Bellcore and J-STD Tests & Results
Please scroll right to view all available information.
Test
Result
J-STD-004 (IPC-TM-650)
Flux Type Classification
ORL0
Presence of Halide Fluoride Spot Test
Pass
Elemental Analysis
Halide-Free
Post Reflow Flux Residue (ICA Test)
0.4% of solder paste
Corrosion
Pass
SIR (Post Clean)
Pass
Acid Value (Typical)
31.5
Please scroll right to view all available information.
Test
Result
J-STD-005 (IPC-TM-650)
Typical Solder Paste Viscosity (Pb92.5/Sn5/Ag2.5. Type 3. 88%)
Brookfield (TF 5 rpm)
230 kcps
Brookfield (R7 10 rpm)
170 kcps
Slump Test
Pass
Solder Ball Test
Pass
Wetting Test
Pass
Standard Metal Load
88%
All information is for reference only. Not to be used as incoming product specifications.
Features:
Ultra-low post-reflow residue <0.5%w/w of solder paste
“Power-Safe” residue compatible with overmolding compounds without delamination
