Plating dies and/or substrates with pure gold works well to prevent the components from oxidizing, but can lead to undesirable gold-rich solder joints. Using an off-eutectic AuSn alloy as the solder material accommodates for these thick gold metallizations, allowing for the exact adjustment of the final solder joint composition to guarantee strong solder joints in die-attach applications.
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The joint may be of polymer (adhesive), metal-filled polymer, or in the form of solder derived from a preform or solder paste. (Die-attach wire may also be available.)
Although there are four major processes for die-attach, solder-based processes are still the most popular, as they provide high reliability with ease of processing. Indium Corporation’s die-attach solder paste is typically a dispensable, high melting-point solder paste, which is reflowed in forming gas (H2N2 mix).
Key Performance Needs
Low voiding in reflow
Long dispense life
Residue-free cleaning or residue compatible with overmolding process
“Power-Safe” NC-SMQ®75 Die-Attach Solder Paste
NC-SMQ®75 is the only solder paste suitable for use in non-cleaned clip-bonded applications in power semiconductor die-attach assemblies. It has:
Superior wetting capabilities compared to most low residue formulations
Indium Corporation’s “Power-Safe” NC-SMQ75 is an ultra-low residue, halogen-free, die-attach solder paste that leaves a completely benign, almost undetectable residue of approximately 0.4 weight percent of paste.
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