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In SMT Assembly, Even One Second of Cycle Time Can Affect Profitability

Folks, Patty had just returned from SMTAI 2015. It was a sentimental meeting with the retirement of longtime executive administrator JoAnn Stromberg. At one of the technical sessions, Patty was

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Epoxy Flux Rework Procedure and Clean-up

Another advantage of Indium Corporation's epoxy flux, such as the 756-72, compared to underfill and other competitive epoxy flux options is that our epoxy flux is reworkable.The rework procedure

Archive

Preheaters Part X – Selecting the Optimum Preheating System

With the exception of the automated system mentioned in my last post, there is little difference in the actual performance of the various forms of preheaters. The choice is based on convenience and

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Epoxy Flux Dispensing and/or Jetting

The dipping process is convenient for the application of epoxy flux because most pick-and-place equipment already has dipping units installed. So, there is no need for extra equipment or the costs

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Preheaters Part IX – Automation and Control

As discussed previously, the temperature of the preheater has little comparison with the actual temperature of the PCB. By implementing a dual preheater system, where there is an infrared heat sensor

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Optimizing the Epoxy Flux Dipping Process

Applying Epoxy flux using a dipping process is similar to the dipping process with conventional PoP flux, with the exception of the flux coverage of the component bump.With conventional PoP flux or

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The Rule of 3/N for Estimating Field Failure Rates

Folks, It looks like Patty is a bit troubled……. When she was younger, Patty was always annoyed by cranky old people, and now she was worrying that she might become one. The trigger that

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Preheaters Part VIII – Heating, Wavelength and Infrared

As I mentioned in my previous post, the goal of preheating, regardless of method used, is to increase the metallic structure of the joint to a specified

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Why Epoxy Flux

Due to the recent increase in interest regarding Epoxy Flux, there are a number of general questions that many people have had about the this unique enabling technology.I decided to sit down with the

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Voiding in the Thermal Ground Pad of BTC Components

Phil Zarrow: With the advent of bottom terminating components, one of the nemesis of the electronic assembler is voiding in the thermal ground pad of the BTC component. Derrick Herron:

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Achieving Uniform Solder Bondline Control Between Substrate and Baseplate in IGBT Assembly: Part II

The next few posts come to us from my colleagues Karthik Vijay, Indium Corporation’s Technical Manager for Europe, and Liam Mills of TT Electronics Power and Hybrid. They’ve done some

Products

Optimizing the PoP Flux Dipping Process

Often times, people assume that the dipping process is easy. It is…once you have taken the time up-front to optimize the process.This optimization can take a bit of time and trial and error.

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Gallium: Discovered too Late to Make Mendeleev’s First Periodic Table

Folks, it has been a while. Let’s look in on Patty…. Patty stared at her new Apple® Watch and was pleased. What was most pleasing is that she didn’t expect to be pleased. She heard many

Products

Achieving Uniform Solder Bondline Control Between Substrate and Baseplate in IGBTs: Part I

The next few posts come to us from my colleagues Karthik Vijay, Indium Corporation’s Technical Manager for Europe and Liam Mills of TT Electronics Power and Hybrid. They’ve done some

Archive

Estimating the Per Cent Gold In An Alloy: “Wet Gold Technique” Only Works with One Alloying Element… and You Must Know What That Element Is

Folks, The Wet Gold Technique is a simple way to estimate the percentage of gold in a gold alloy. This technique indirectly measures the density of the alloy. From the density of the alloy one can

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Graphene: An Unlikely Candidate to Replace ITO in Flat Panel Displays

Folks, Let’s check in on Rob, while Patty is away…… Rob waved good bye to Patty as she drove away to the airport to attend a one week conference. Now that she was a prof and he a grad student

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Preheating Part VII – Lamp-Type Infrared and Ceramic Plate

Lamp style preheaters have the fastest response time of any of the previous preheaters mentioned in other posts. The lamp filament is practically the sole thermal mass; it is so fast that the

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Changing the Composition of Your Tin-Lead Solder Pot

In today's electronics manufacturing industry, many companies are using lead-free solder alloys. However, there are a few sectors in the industry that prefer the reliability and performance of

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Preheaters Part VI – Quartz Tube

As a follow up to my post on quartz plate preheaters for wave soldering, this post isdedicated to the very similar quartz tube preheater. If you remember, one of the advantages of using a quartz

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Preheating Part V – Quartz Plate

We continue our discussion of solder reflow methods. As the name suggests, quartz plate preheaters have thick quartz plates in which the heating elements are embedded via pockets or slots. The

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Preheating Part IV – Hot Air

My last post talked about the pros and cons of CalRod® style preheaters. This post will be devoted to hot air style preheaters. It makes sense that this was, most likely, the first form of

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